Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이성환 | - |
dc.date.accessioned | 2023-07-12T02:03:44Z | - |
dc.date.available | 2023-07-12T02:03:44Z | - |
dc.date.issued | 2003-04 | - |
dc.identifier.citation | JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v. 46, NO. 2, Page. 140-144 | - |
dc.identifier.issn | 1344-7912 | - |
dc.identifier.uri | https://www.jstage.jst.go.jp/article/jsmea/46/2/46_2_140/_article | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/183132 | - |
dc.description.abstract | An analytical model for lateral cracks occurring in abrasive wear of brittle materials was developed. The stress field around the lateral crack and the stress intensity factor at the crack tip were analytically modeled. The abrasive wear by abrasive particles was experimentally studied by sliding indentation. In soda-lime glass, it was observed that chipping by the lateral crack occurred and produced the greatest material removal when the normal load applied by the sliding indenter was about 1.5-2.0N. Prediction of length of the lateral crack from the model was compared with the experimentally measured length in the soda-lime glass. | - |
dc.language | en | - |
dc.publisher | JAPAN SOC MECHANICAL ENGINEERS | - |
dc.subject | abrasive wear | - |
dc.subject | lateral crack | - |
dc.subject | brittle materials | - |
dc.subject | chipping | - |
dc.subject | stress intensity factor | - |
dc.title | Lateral crack in abrasive wear of brittle materials | - |
dc.type | Article | - |
dc.relation.no | 2 | - |
dc.relation.volume | 46 | - |
dc.identifier.doi | 10.1299/jsmea.46.140 | - |
dc.relation.page | 140-144 | - |
dc.relation.journal | JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING | - |
dc.contributor.googleauthor | Ahn, Yoomin | - |
dc.contributor.googleauthor | Cho, Nahm-Gyoo | - |
dc.contributor.googleauthor | Lee, Seoung-Hwan | - |
dc.contributor.googleauthor | Lee, Dohyung | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 기계공학과 | - |
dc.identifier.pid | sunglee | - |
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