130 0

Full metadata record

DC FieldValueLanguage
dc.contributor.author이정호-
dc.date.accessioned2023-05-25T01:10:22Z-
dc.date.available2023-05-25T01:10:22Z-
dc.date.issued2011-05-
dc.identifier.citationJournal of Electronic Materials, v. 40, NO. 5, Page. 1321-1325-
dc.identifier.issn0361-5235;1543-186X-
dc.identifier.urihttps://link.springer.com/article/10.1007%2Fs11664-011-1629-6en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/181390-
dc.description.abstractThermoelectric Sb (x) Te (y) films were potentiostatically electrodeposited in aqueous nitric acid electrolyte solutions containing different concentrations of TeO2. Stoichiometric Sb (x) Te (y) films were obtained by applying a voltage of -0.15 V versus saturated calomel electrode (SCE) using a solution consisting of 2.4 mM TeO2, 0.8 mM Sb2O3, 33 mM tartaric acid, and 1 M HNO3. The nearly stoichiometric Sb2Te3 films had a rhombohedral structure, R (3) over barm with a preferred orientation along the (015) direction. The films had hole concentration of 5.8 x 10(18)/cm(3) and exhibited mobility of 54.8 cm(2)/Vs. A more negative potential resulted in higher Sb content in the deposited Sb (x) Te (y) films. Furthermore, it was observed that the hole concentration and mobility decreased with increasingly negative deposition potential, and eventually showed insulating properties, possibly due to increased defect formation. The absolute value of the Seebeck coefficient of the as-deposited Sb2Te3 thin film at room temperature was 118 mu V/K.-
dc.description.sponsorshipThis work was supported by the Pioneer Research Center Program through the National Research Foundation of Korea funded by the Ministry of Education, Science, and Technology (2010-0002238).-
dc.languageen-
dc.publisherInstitute of Electrical and Electronics Engineers-
dc.subjectThermoelectric films-
dc.subjectp-type SbxTey-
dc.subjectelectrodeposition-
dc.subjectSeebeck coefficient-
dc.titleElectrodeposition of p-Type SbxTey Thermoelectric Films-
dc.typeArticle-
dc.relation.no5-
dc.relation.volume40-
dc.identifier.doi10.1007/s11664-011-1629-6-
dc.relation.page1321-1325-
dc.relation.journalJournal of Electronic Materials-
dc.contributor.googleauthorLim, Jae-Hong-
dc.contributor.googleauthorPark, Mi Yeong-
dc.contributor.googleauthorLim, Dong Chan-
dc.contributor.googleauthorYoo, Bongyoung-
dc.contributor.googleauthorLee, Jung-Ho-
dc.contributor.googleauthorMyung, Nosang V.-
dc.contributor.googleauthorLee, Kyu Hwan-
dc.sector.campusE-
dc.sector.daehak공학대학-
dc.sector.department재료화학공학과-
dc.identifier.pidjungho-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE