Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2023-05-24T01:58:31Z | - |
dc.date.available | 2023-05-24T01:58:31Z | - |
dc.date.issued | 2009-00 | - |
dc.identifier.citation | ECS Transactions, v. 25, NO. 5, Page. 95-99 | - |
dc.identifier.issn | 1938-5862;1938-6737 | - |
dc.identifier.uri | https://iopscience.iop.org/article/10.1149/1.3202640 | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/181263 | - |
dc.description.abstract | Pad conditioning is a necessary step during CMP (Chemical Mechanical Planarization) process to maintain the performance such as uniform material removal rate and its uniformity. The Ni electroplated diamond conditioner has been used and its surface could be easily contaminated by slurry particles and by-products during conditioning. We have proposed the hydrophobic SAM (self assembled monolayer) modification to CMP conditioner to reduce residue contamination. After CMP conditioning process, the contamination was reduced highly on the surface of the conditioner when it was coated with hydrophobic film. | - |
dc.description.sponsorship | This research was financially supported by Shinhan Diamond Industrial Co. and by the Korea Science and Engineering Foundation (KOSEF) grant funded by the Korea government (MEST) (No. R11-2008-044-00000-0). Also this work has been supported by Center for Integrated Human Sensing System at Hanyang University. | - |
dc.language | en | - |
dc.publisher | Electrochemical Society, Inc. | - |
dc.title | SAM modification of CMP conditioner for the prevention of particle adhesion | - |
dc.type | Article | - |
dc.relation.no | 5 | - |
dc.relation.volume | 25 | - |
dc.identifier.doi | 10.1149/1.3202640 | - |
dc.relation.page | 95-99 | - |
dc.relation.journal | ECS Transactions | - |
dc.contributor.googleauthor | Kwon, Tae Young | - |
dc.contributor.googleauthor | Kang, Young-Jae | - |
dc.contributor.googleauthor | Kim, In-Kwon | - |
dc.contributor.googleauthor | Kim, Dong Chan | - |
dc.contributor.googleauthor | Kim, Jeong | - |
dc.contributor.googleauthor | Chun, Jong sun | - |
dc.contributor.googleauthor | Park, Mun seak | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 재료화학공학과 | - |
dc.identifier.pid | jgpark | - |
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