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dc.contributor.author박진구-
dc.date.accessioned2023-05-24T01:29:50Z-
dc.date.available2023-05-24T01:29:50Z-
dc.date.issued2011-00-
dc.identifier.citationECS Transactions, v. 41, NO. 5, Page. 229-236-
dc.identifier.issn1938-5862;1938-6737-
dc.identifier.urihttps://iopscience.iop.org/article/10.1149/1.3630848en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/181238-
dc.description.abstractCO 2 gas cluster cleaning process for nano particles removal without pattern damage was investigated. Gas cluster cleaning process was performed for generating the nano-sized gas cluster in the vacuum chamber. When pressurized CO 2 gas was passed through the convergence-divergence (C-D) nozzle, the high speed and high energy gas clusters were generated. The cleaning force of CO 2 gas cluster is related to flow rate of the gas and gap distance between the nozzle and substrate. In our studies, the optimum gas flow rate and gap distance for nano-sized particles removal was found, respectively. Pattern damage tests of the poly-Si and a-Si pattern were also evaluated by SEM images. No pattern damages were observed at these optimum conditions. ©The Electrochemical Society.-
dc.languageen-
dc.publisherThe Electrochemical Society-
dc.titleNano gas cluster dry cleaning for damage free particle removal-
dc.typeArticle-
dc.relation.no5-
dc.relation.volume41-
dc.identifier.doi10.1149/1.3630848-
dc.relation.page229-236-
dc.relation.journalECS Transactions-
dc.contributor.googleauthorKim, Min su-
dc.contributor.googleauthorKang, Bong Kyun-
dc.contributor.googleauthorLee, Seung Ho-
dc.contributor.googleauthorYoon, Deok joo-
dc.contributor.googleauthorChoi, Hoomi-
dc.contributor.googleauthorKim, Ho joong-
dc.contributor.googleauthorKim, Tae sung-
dc.contributor.googleauthorPark, Jin-Goo-
dc.sector.campusE-
dc.sector.daehak공학대학-
dc.sector.department재료화학공학과-
dc.identifier.pidjgpark-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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