Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2023-05-24T00:31:19Z | - |
dc.date.available | 2023-05-24T00:31:19Z | - |
dc.date.issued | 2014-11 | - |
dc.identifier.citation | ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014, article no. 7017249, Page. 70-74 | - |
dc.identifier.uri | https://ieeexplore.ieee.org/document/7017249 | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/181186 | - |
dc.description.abstract | The effect of Cu surface conditions on Cu-BTA complex was investigated using ex-situ electrochemical impedance spectroscopy method. Cu-BTA complex is generated during Cu CMP process because BTA which is the most common corrosion inhibitor in Cu CMP slurry react with Cu and form a strong complex. Then it is very important to remove Cu-BTA complex during post-Cu CMP cleaning because Cu-BTA complex cause severe problem such as particle contamination and watermark due to its hydrophobic characteristic. The Cu-BTA complex formation at various Cu surfaces was investigated to understand its behavior, so the effective development will be possible in post-Cu CMP cleaning process. © 2014 IEEE. | - |
dc.description.sponsorship | This research was financially supported by EBARA. | - |
dc.language | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Investigation of Cu-BTA complex formation and removal on various Cu surface conditions | - |
dc.type | Article | - |
dc.identifier.doi | 10.1109/ICPT.2014.7017249 | - |
dc.relation.page | 70-74 | - |
dc.relation.journal | ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 | - |
dc.contributor.googleauthor | Cho, Byoung jun | - |
dc.contributor.googleauthor | Park, Jin-Goo | - |
dc.contributor.googleauthor | Shima, Shohei | - |
dc.contributor.googleauthor | Hamada, Satomi | - |
dc.sector.campus | E | - |
dc.sector.daehak | 공학대학 | - |
dc.sector.department | 재료화학공학과 | - |
dc.identifier.pid | jgpark | - |
dc.identifier.article | 7017249 | - |
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