Repository at Hanyang UniversityCOLLEGE OF ENGINEERING SCIENCES[E](공학대학)MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)Articles
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 유봉영 | - |
| dc.date.accessioned | 2023-05-19T05:58:43Z | - |
| dc.date.available | 2023-05-19T05:58:43Z | - |
| dc.date.issued | 2021-06 | - |
| dc.identifier.citation | 한국표면공학회지, v. 54, NO. 3, Page. 158-163 | - |
| dc.identifier.issn | 1225-8024;2288-8403 | - |
| dc.identifier.uri | http://koreascience.or.kr/article/JAKO202121061557457.page | en_US |
| dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/180929 | - |
| dc.description.abstract | Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described. | - |
| dc.description.sponsorship | 본 연구는 중소벤처기업부의 기술개발사업[S3106002]과 산업통상자원부의 글로벌주력산업품질대응뿌리기술개발[20016445]의 지원에 의한 연구임 | - |
| dc.language | ko | - |
| dc.publisher | 한국표면공학회 | - |
| dc.subject | Copper | - |
| dc.subject | 3D printing | - |
| dc.subject | electroplating package | - |
| dc.title | 선택적 전기화학 3D 프린터 기술 소개 및 PCB 양산공정 적용방식 고찰 | - |
| dc.title.alternative | Introduction of Selective Electrochemical Additive Manufacturing Technology and Consideration of Integration Method for PCB Mass Production Process | - |
| dc.type | Article | - |
| dc.relation.no | 3 | - |
| dc.relation.volume | 54 | - |
| dc.identifier.doi | 10.5695/JKISE.2021.54.3.158 | - |
| dc.relation.page | 158-163 | - |
| dc.relation.journal | 한국표면공학회지 | - |
| dc.contributor.googleauthor | 김성빈 | - |
| dc.contributor.googleauthor | 유봉영 | - |
| dc.sector.campus | E | - |
| dc.sector.daehak | 공학대학 | - |
| dc.sector.department | 재료화학공학과 | - |
| dc.identifier.pid | byyoo | - |
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