Modification of Micro/Nanoparticles for various applications via Powder Atomic Layer Deposition

Abstract

Fine particles have been used in various technical fields for decades, and this paper proposes a method to improve electrochemical/mechanical properties suitable for specific applications by depositing a passivation layer on various powder bases through a self-developed powder atomic layer deposition (P-ALD) process. X-ray fluorescence (XRF), transmission electron microscopy (TEM), and energy dispersion spectroscopy (EDS) are used to analyze passivation layer properties suitable for specific applications, and individual properties are evaluated.

In order to manufacture CMP Slurry that achieves Low cost-High polishing performance among various Applications, an optimized ALD condition was established to deposit an aluminum oxide protective film with high polishing properties on an inexpensive silica base material. The modified particles could confirm improved dispersion stability by measuring Zeta Potential compared to the base material, and the improved removal rate performance could be analyzed. Advanced CMP slurry was manufactured by depositing a passivation layer with a Polishing property that is excellent for realizing a semiconductor fine pattern at a nm-scale. In addition, to realize the next-generation battery, Alucone, an organic/inorganic hybrid coating layer, is deposited on a silicon anodic material (MLD) to prevent the degradation of battery cell characteristics due to irreversible volume change and structural instability caused by silicon expansion (~300%). Experiments on the conditions and protective layers of flexible Alucone that allow reversible volume change on silicon powder improved from 92.5% coulombic efficiency of Bare Silicon to 96.2%, capacity retention improved by 10% and stabilized silicon, the next-generation Battery Anodic material.