Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 소홍윤 | - |
dc.date.accessioned | 2022-12-02T00:51:59Z | - |
dc.date.available | 2022-12-02T00:51:59Z | - |
dc.date.issued | 2022-02 | - |
dc.identifier.citation | International Journal of Heat and Mass Transfer, v. 183, article no. 122236, Page. 1-6 | en_US |
dc.identifier.issn | 0017-9310;1879-2189 | en_US |
dc.identifier.uri | https://www.sciencedirect.com/science/article/pii/S0017931021013351?via%3Dihub | en_US |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/177778 | - |
dc.description.abstract | Temperature monitoring of electronic devices is important to prevent the active components from overheating. In this study, a novel method to obtain the overall temperature map of electronic modules with limited local temperature data was suggested using a deep-neural-network-based multi-output regression model. To predict the entire temperature distribution with minimum data, one to six random inputs considering their diverse arrangements were applied and compared by calculating the mean absolute error. In addition, the temperature prediction accuracy of the heating element was considered as an important parameter for the performance score. Consequently, a temperature prediction accuracy of ∼96.7% was realized using three input local data points close to the heat source. Furthermore, with the other three temperature data points away from the heat source, the score increased by ∼11.6% (∼79.9 to ∼89.2%) after the hyperparameter tuning processes. These results support the precise noncontact virtual sensing technology of temperature monitoring methods for various industries, such as electric vehicles, cold-chain warehouses, and robotics. | en_US |
dc.description.sponsorship | This work was supported by the Korea Institute of Energy Technology Evaluation and Planning (KETEP) and granted financial resources from the Ministry of Trade, Industry & Energy of the Republic of Korea (No. 20192010106690). | en_US |
dc.language | en | en_US |
dc.publisher | Elsevier Ltd | en_US |
dc.subject | Deep neural network | en_US |
dc.subject | Temperature mapping | en_US |
dc.subject | Thermal imaging | en_US |
dc.subject | Thermal management | en_US |
dc.subject | Virtual sensors | en_US |
dc.title | Noncontact thermal mapping method based on local temperature data using deep neural network regression | en_US |
dc.type | Article | en_US |
dc.relation.volume | 183 | - |
dc.identifier.doi | 10.1016/j.ijheatmasstransfer.2021.122236 | en_US |
dc.relation.page | 1-6 | - |
dc.relation.journal | International Journal of Heat and Mass Transfer | - |
dc.contributor.googleauthor | Shin, Sanghun | - |
dc.contributor.googleauthor | Ko, Byeongjo | - |
dc.contributor.googleauthor | So, Hongyun | - |
dc.sector.campus | S | - |
dc.sector.daehak | 공과대학 | - |
dc.sector.department | 기계공학부 | - |
dc.identifier.pid | hyso | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.