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dc.contributor.author홍제형-
dc.date.accessioned2022-10-13T01:32:15Z-
dc.date.available2022-10-13T01:32:15Z-
dc.date.issued2021-01-
dc.identifier.citation2020 25TH INTERNATIONAL CONFERENCE ON PATTERN RECOGNITION (ICPR), page. 2398-2405en_US
dc.identifier.isbn978-1-7281-8808-9-
dc.identifier.isbn978-1-7281-8809-6-
dc.identifier.issn1051-4651en_US
dc.identifier.urihttps://ieeexplore.ieee.org/document/9412372en_US
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/175312-
dc.description.abstractWhile potteries are common artifacts excavated in archaeological sites, the restoration process relies on manual cleaning and reassembly of shattered pieces. Since the number of possible 3D configurations is considerably large, the exhaustive manual trial may result in abrasion on fractured surfaces and even failure to find the correct matches. As a result, many recent works suggest virtual reassembly from 3D scans of the fragments. The problem is challenging in the view of the conventional 3D geometric analysis, as it is hard to extract reliable shape features from the thin break lines. We propose to optimize for the global configuration by combining geometric constraints with information from noisy shape features. Specifically, we enforce bijection and continuity of sequence of correspondences given estimates of corners and pair-wise matching scores between multiple break lines. We demonstrate that our pipeline greatly increases the accuracy of correspondences, resulting in stable restoration of 3D configurations from irregular and noisy evidence.en_US
dc.description.sponsorshipThis work was supported by the New Faculty Startup Fund from Seoul National University and South Korea's Ministry of Culture, Sports and Tourism (MCST) and the Korea Creative Content Agency (KOCCA) in the Culture Technology (CT) Research & Development Program (R2018020101).en_US
dc.language.isoenen_US
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCen_US
dc.title3D Pots Configuration System by Optimizing Over Geometric Constraintsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/ICPR48806.2021.9412372en_US
dc.relation.page2398-2405-
dc.contributor.googleauthorKim, Jae Eun-
dc.contributor.googleauthorArshad, Muhammad Zeeshan-
dc.contributor.googleauthorJong, Yoo Seong-
dc.contributor.googleauthorHong, Je-Hyung-
dc.contributor.googleauthorKim, Jinwook-
dc.contributor.googleauthorKim, Young Min-
dc.relation.code20210142-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentSCHOOL OF ELECTRONIC ENGINEERING-
dc.identifier.pidjhh37-
dc.identifier.researcherIDAAY-2976-2021-
dc.identifier.orcidhttps://orcid.org/0000-0003-2797-553X-
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COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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