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dc.contributor.author박진석-
dc.date.accessioned2022-07-29T00:46:35Z-
dc.date.available2022-07-29T00:46:35Z-
dc.date.issued2021-02-
dc.identifier.citationELECTRONIC MATERIALS LETTERS, v. 17, NO 3, Page. 260-267en_US
dc.identifier.issn2093-6788-
dc.identifier.issn1738-8090-
dc.identifier.urihttps://link.springer.com/article/10.1007/s13391-021-00271-2-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/171886-
dc.description.abstractIn this study, we present a new and simple method that utilizes post-processing such as thermal treatment and mechanical compression to manufacture a grid patterned silver nanowire (AgNW) flexible transparent electrode with low sheet resistance, high transmittance, and high flexibility. The effects of thermal treatment and mechanical compression on the structural, optical, and electrical properties of AgNW deposited by bar coating have been analyzed as a function of temperature and pressure. It was discovered that there is a critical thermal treatment temperature (T-c) that determined the abrupt change-decreasing, then rapidly increasing-in the sheet resistance of AgNW. When additional pressure was applied during thermal treatment, T-c was lowered. The cohesion between AgNW wires was improved by thermal treatment below T-c, and further strengthened when pressure was applied simultaneously with heat. However, when thermal treatment was performed above T-c, the unique wire structure of AgNW collapsed. It has also been found that heat treatment and mechanical compression improve the flexibility of AgNW.en_US
dc.description.sponsorshipThis research was supported by BK21PLUS program through the National Research Foundation of Korea funded by the Ministry of Education.en_US
dc.language.isoenen_US
dc.publisherKOREAN INST METALS MATERIALSen_US
dc.subjectSilver nanowire (AgNW)en_US
dc.subjectFlexible transparent electrodeen_US
dc.subjectGrid-pattern formationen_US
dc.subjectThermal treatmenten_US
dc.subjectMechanical compressionen_US
dc.titleCharacterization of Silver Nanowire Flexible Transparent Electrode with Grid Pattern Formed via Thermocompressionen_US
dc.typeArticleen_US
dc.relation.no3-
dc.relation.volume17-
dc.identifier.doi10.1007/s13391-021-00271-2-
dc.relation.page260-267-
dc.relation.journalELECTRONIC MATERIALS LETTERS-
dc.contributor.googleauthorPark, Jong-Seol-
dc.contributor.googleauthorPark, Tae-Gon-
dc.contributor.googleauthorPark, Jin-Seok-
dc.relation.code2021009426-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentSCHOOL OF ELECTRICAL ENGINEERING-
dc.identifier.pidjinsp-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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