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dc.contributor.author이영문-
dc.date.accessioned2021-12-23T04:16:50Z-
dc.date.available2021-12-23T04:16:50Z-
dc.date.issued2021-02-
dc.identifier.citation2021 Design, Automation & Test in Europe Conference & Exhibition, Page. 1252-1255en_US
dc.identifier.isbn978-3-9819263-5-4-
dc.identifier.issn1558-1101-
dc.identifier.issn1530-1591-
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/9474042-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/167013-
dc.description.abstractModern embedded systems face challenges in managing on-chip temperature as they are increasingly realized in powerful system-on-chips. This paper presents thermal-aware design and management of embedded systems by tightly coupling two mechanisms, thermal-aware utilization bound and real-time dynamic thermal management. The former provides the processor utilization upper-bound to meet the chip temperature constraint that depends not only on the system configurations and workloads but also chip cooling capacity and environment. The latter adaptively optimizes rates of individual task executions subject to the thermal-aware utilization bound. Our experiments on an automotive controller demonstrate the thermal-aware utilization bound and improved system utilization by 18.2 % compared with existing approaches.en_US
dc.language.isoen_USen_US
dc.publisherIEEEen_US
dc.titleThermal-Aware Design and Management of Embedded Real-Time Systemsen_US
dc.typeArticleen_US
dc.relation.page1-4-
dc.contributor.googleauthorLee, Youngmoon-
dc.relation.code20200104-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDEPARTMENT OF ROBOT ENGINEERING-
dc.identifier.pidyoungmoonlee-
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COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ROBOT ENGINEERING(로봇공학과) > Articles
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