Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 신동혁 | - |
dc.date.accessioned | 2021-06-30T05:23:56Z | - |
dc.date.available | 2021-06-30T05:23:56Z | - |
dc.date.issued | 2000-10 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v. 29, no. 10, page. 1153-1159 | en_US |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | https://www.proquest.com/docview/204861452?accountid=11283 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/162607 | - |
dc.description.abstract | In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy input rate and time, and the shape of solder disk on the microstructure of the solder/Cu pad interface and the shear strength of the joints were investigated. It was demonstrated that a proper combination of the variables could lead to the formation of a spherical solder bump with shear strength comparable to that formed via the conventional reflow soldering process. In addition, the kinetics of Cu pad dissolution into the solder during laser heating was modeled numerically to elucidate intermetallic formation mechanism at the solder/Cu pad interface. | en_US |
dc.description.sponsorship | Authors would like to appreciate the financial support of Ministry of Education of Korea for this study. Also, authors thank for the valuable contribution of Dr. S.W. Yoon for measuring the shear strength ofthe joints. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | The Minerals,Metals & Materials Society | en_US |
dc.subject | shear strength | en_US |
dc.subject | solder disk | en_US |
dc.subject | energy input rate | en_US |
dc.subject | laser reflow solder bumping | en_US |
dc.subject | Fluxless soldering | en_US |
dc.title | Characteristics of the Sn-Pb Eutectic Solder Bump Formed via Fluxless Laser Reflow Soldering | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1007/s11664-000-0006-7 | - |
dc.relation.journal | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.contributor.googleauthor | Lee, J.-H. | - |
dc.contributor.googleauthor | Park, D. | - |
dc.contributor.googleauthor | Lee, Y.-H. | - |
dc.contributor.googleauthor | Kim, Y.-S. | - |
dc.contributor.googleauthor | Moon, J.-T. | - |
dc.contributor.googleauthor | Shin, D.-H. | - |
dc.relation.code | 2009205022 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING | - |
dc.identifier.pid | dhshin | - |
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