Repository at Hanyang UniversityCOLLEGE OF ENGINEERING SCIENCES[E](공학대학)ELECTRICAL ENGINEERING(전자공학부)Articles
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dc.contributor.author홍승호-
dc.date.accessioned2021-06-30T05:03:49Z-
dc.date.available2021-06-30T05:03:49Z-
dc.date.issued2000-10-
dc.identifier.citation제어로봇시스템학회 논문지, v. 1, page. 1181-1184en_US
dc.identifier.urihttps://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02050672-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/162568-
dc.description.abstractIn this study, physical and data link layer protocols of FOUNDATION fieldbus are implemented. INTEL386EX and 80196KC are used for CPU of PC interface board and sensor interface module, respectively. The physical layer protocol of FOUNDATION fieldbus is developed by using FB3050 chip, the fieldbus communication controller ASIC. The data link layer protocol of FOUNDATION fieldbus is implemented by software.en_US
dc.language.isoko_KRen_US
dc.publisher제어로봇시스템학회en_US
dc.subjectFieldbusen_US
dc.subjectFOUNDATIONen_US
dc.subjectPC boarden_US
dc.subjectsensor moduleen_US
dc.titleFOUNDATION 필드버스 인터페이스 보드 구현en_US
dc.title.alternativeImplementation of FOUNDATION Fieldbus Interface Boarden_US
dc.typeArticleen_US
dc.relation.journal제어·자동화·시스템공학논문지-
dc.contributor.googleauthor최인호-
dc.contributor.googleauthor홍승호-
dc.relation.code2012101127-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidshhong-
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