Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김우승 | - |
dc.date.accessioned | 2021-01-20T05:14:03Z | - |
dc.date.available | 2021-01-20T05:14:03Z | - |
dc.date.issued | 2002-04 | - |
dc.identifier.citation | 대한기계학회논문집 B권, v. 26, no. 11, page. 1597-1604 | en_US |
dc.identifier.issn | 1226-4881 | - |
dc.identifier.uri | http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00530572 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/157229 | - |
dc.description.abstract | In this study, numerical investigation has been pcrfonned on the impingement, spreading and solidification of a coating material droplet impacting onto a solid substrate in the thennal spray process. The numerical model is validated through the comparison of the present numerical result with experimental data for the flat substrate without surface defects. An analysis of deposition fonnation on the non-polished substrate with surface defects is also perfonned. The parametric study is conducted with various surface defect sizes and shapes to examine the effect of surface defects on the impact and solidification of the liquid droplet on the substrate. | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 대한기계학회 | en_US |
dc.subject | Thermal Spray(용사) | en_US |
dc.subject | Liquid Droplet(금속 액적) | en_US |
dc.subject | Free Surface(자유표면) | en_US |
dc.subject | Thermal Contact Resistance(접촉 열저항) | en_US |
dc.subject | Solidification(응고) | en_US |
dc.subject | Surface Defect (표면결함) | en_US |
dc.title | 표면 결함이 있는 모재에 대한 용사 공정에서 용융 금속 액적의 충돌현상과 응고 과정 해석 | en_US |
dc.title.alternative | A Study on the Impact and Solidification of the Liquid Metal Droplet in the Thermal Spray Deposition onto the Substrate with Surface Defects | en_US |
dc.type | Article | en_US |
dc.contributor.googleauthor | 하응지 | - |
dc.contributor.googleauthor | 김우승 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | wskim | - |
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