Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 이도형 | - |
dc.date.accessioned | 2020-12-31T02:06:44Z | - |
dc.date.available | 2020-12-31T02:06:44Z | - |
dc.date.issued | 2003-11 | - |
dc.identifier.citation | 대한기계학회 2003년 추계학술대회논문집, page. 922-927 | en_US |
dc.identifier.uri | http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00549068? | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/156518 | - |
dc.description.abstract | In this paper, slurry fluid motion, abrasive particle motion, and roles of groove patterns on the pads are numerically investigated in the 2D and 3D geometries. The simulation results are analyzed in terms of experimental removal rate and WIWNU (within wafer non-uniformity) for ILD (inter level dielectric) CMP process. Numerical investigations reveal that the grooves in the pad behave as uniform distributor of abrasive particles and enhance the removal rate by increasing shear stress. Higher removal rate and desirable uniformity are numerically and experimentally observed at the pad with grooves. Numerical analysis is very well matched with experimental results and helpful for understanding polishing mechanism and local physics. | en_US |
dc.description.sponsorship | 본 연구는 한양대학교 교내 연구비에 의해 진행되었으며 이에 감사합니다. | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 대한기계학회 | en_US |
dc.subject | CMP | en_US |
dc.subject | slurry | en_US |
dc.subject | groove | en_US |
dc.subject | Pad | en_US |
dc.subject | CFD | en_US |
dc.subject | 기계적 화학적 연마 | en_US |
dc.subject | 슬러리 | en_US |
dc.subject | 그루브 | en_US |
dc.subject | 패드 | en_US |
dc.subject | 전산유 체역학 | en_US |
dc.title | Oxide CMP 과정에 대한 수치 유동 해석 | en_US |
dc.title.alternative | Numerical Study on Polishing Behavior during Oxide CMP | en_US |
dc.type | Article | en_US |
dc.contributor.googleauthor | 권달중 | - |
dc.contributor.googleauthor | 이도형 | - |
dc.contributor.googleauthor | 홍의관 | - |
dc.contributor.googleauthor | 박진구 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | dohyung | - |
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