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dc.contributor.author이병주-
dc.date.accessioned2020-12-16T05:56:39Z-
dc.date.available2020-12-16T05:56:39Z-
dc.date.issued2003-10-
dc.identifier.citation제어로봇시스템학회 국제학술대회 논문집, page. 1598-1602en_US
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE02007990?-
dc.identifier.urihttps://www.koreascience.or.kr/article/CFKO200333239337064.page-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/156296-
dc.description.abstractThe parallel-type mechanism provides more accurate and stiff motion than the serial-type mechanism. However, in case of using the haptic device, the performance of the force reflection can be deteriorated due to the singular points existing in workspace. In this paper, we propose a redundantly actuated parallel 3-DOF haptic device, which is singularity-free in the workspace and has an improved force reflection capability. In addition, we propose a new force distribution algorithm, which can reflect force of both high and low resolution, using two sets of actuator with different size. Redundant actuators are attached to the base frame in order to minimize the inertia of the system. Moreover, a wire and gear reduction system is employed to achieve high force reflection along with soft feeling. We confirm the performance of the force reflection capability throughout simulation.en_US
dc.language.isoen_USen_US
dc.publisherInstitute of Control, Robotics and Systems (제어로봇시스템학회)en_US
dc.subjectRedundant Actuationen_US
dc.subjectTorque distributionen_US
dc.titleForce distribution algorithm for singularity-free 3-DOF parallel haptic device with redundant actuationen_US
dc.typeArticleen_US
dc.contributor.googleauthorKim, Tae-Ju-
dc.contributor.googleauthorChung, Goo-Bong-
dc.contributor.googleauthorYi, Byung-Ju-
dc.contributor.googleauthorSeo, Il-Hong-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidbj-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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