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dc.contributor.author김희준-
dc.date.accessioned2020-11-30T00:32:23Z-
dc.date.available2020-11-30T00:32:23Z-
dc.date.issued2003-07-
dc.identifier.citation전력전자학회 2003년 학술대회논문집(2), page. 781-784en_US
dc.identifier.issn2636-1620-
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE00552715?-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/156054-
dc.description.abstract다층 PCB를 이용한 고밀도 전원을 개발함. In this paper, high density on-board dc/dc converter using multi-layer PCB is proposed. Recently, the communication system wants power supply of open-frame, high density and low profile. So experimental converter was consisted of 33V/30A Quarter Brick size DC/DC Converter. To power height limit, coil of transformer, choke and circuits were consisted of multi layer PCB. Besides to Improve of efficiency. made secondary synchronous rectifier Mosfet driving circuit. So total efficiency could be improved.en_US
dc.language.isoko_KRen_US
dc.publisher전력전자학회en_US
dc.title다층PCB를 이용한 고밀도 On-board DC/DC Converteren_US
dc.title.alternativeHigh Density On-Board DC/DC Converter Using Multi-Layer PCBen_US
dc.typeArticleen_US
dc.contributor.googleauthor김영필-
dc.contributor.googleauthor김태식-
dc.contributor.googleauthor임범선-
dc.contributor.googleauthor김희준-
dc.sector.campusE-
dc.sector.daehakCOLLEGE OF ENGINEERING SCIENCES[E]-
dc.sector.departmentDIVISION OF ELECTRICAL ENGINEERING-
dc.identifier.pidhjkim-
Appears in Collections:
COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > ELECTRICAL ENGINEERING(전자공학부) > Articles
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