Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2020-10-26T05:58:36Z | - |
dc.date.available | 2020-10-26T05:58:36Z | - |
dc.date.issued | 2003-02 | - |
dc.identifier.citation | Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI, Page.41-45 | en_US |
dc.identifier.issn | 1078-8743 | - |
dc.identifier.uri | https://ieeexplore.ieee.org/document/1194464?arnumber=1194464&SID=EBSCO:edseee | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/154922 | - |
dc.description.abstract | A new dry cleaning technology: laser-induced shock cleaning has been applied to remove the submicron particles (including post-CMP (chemical-mechanical polishing)) slurries from silicon wafer surfaces. The cleaning effectiveness of the new technology was evaluated quantitatively using a laser surface scanner. The results show that most of the silica particles on the wafer surface were removed after exposure to the laser-induced shock waves. The average removal efficiency of the particles was over 99%. The results show that cleaning efficiency is strongly dependent on a gap distance between laser focus point and the wafer surface and that a suitable control of the gap is crucial for the successful removal of the particles. In addition, this new technique was also applied successfully to the removal of the post-CMP slurries from polished patterned wafers. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | IEEE | en_US |
dc.subject | Dry cleaning | en_US |
dc.subject | submicron panicle removal | en_US |
dc.subject | laser shock cleaning | en_US |
dc.subject | post CMF' cleaning | en_US |
dc.subject | plasma shock wave | en_US |
dc.subject | adhesion force | en_US |
dc.title | Laser Shock Removal of Micro and Nanoscale Particles | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/ASMC.2003.1194464 | - |
dc.contributor.googleauthor | Busnaina, A.A. | - |
dc.contributor.googleauthor | Park, J.G. | - |
dc.contributor.googleauthor | Lee, J.M. | - |
dc.contributor.googleauthor | You, S.Y. | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING | - |
dc.identifier.pid | jgpark | - |
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