Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 윤상원 | - |
dc.date.accessioned | 2020-10-21T01:59:11Z | - |
dc.date.available | 2020-10-21T01:59:11Z | - |
dc.date.issued | 2019-10 | - |
dc.identifier.citation | 2019 IEEE Energy Conversion Congress and Exposition (ECCE), Page. 4097-4101 | en_US |
dc.identifier.isbn | 978-1-7281-0395-2 | - |
dc.identifier.issn | 2329-3748 | - |
dc.identifier.uri | https://ieeexplore.ieee.org/document/8912910 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/154688 | - |
dc.description.abstract | This paper reports a new design of a 4-pack super-junction MOSFET power module using a transfer molding process. This module initially targets industrial applications, such as photovoltaic (PV) inverters or energy storage system (ESS). Many conventional 650V power modules are gel-filled IGBT modules, but our transfer molded super-junction MOSFET power module can satisfy electrical insulation and thermal conductivity with potential reduction in production cost and module volume. Super-junction MOSFET dies are soldered on a direct bonded copper (DBC) substrate in the power module. Fabrication process is also customized to the molded super-junction MOSFET module. The designed power modules are successfully fabricated, demonstrating a volume reduction. The fabricated modules are evaluated by FEM simulations and experiments, which exhibit excellent thermal and electrical performances. A small thermal resistance (~0.26 K/W) and package on-resistance (~15.7mΩ) are achieved. | en_US |
dc.description.sponsorship | This work was supported by Korea Evaluation Institute of Industrial Technology(KEIT) grant funded by the Korea government(MOTIE) (No. 10080269, Development of Industrial 650V 4-Pack MOSFET Module) | en_US |
dc.language.iso | en | en_US |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | en_US |
dc.subject | 4-Pack Power Module | en_US |
dc.subject | Super-Junction MOSFET | en_US |
dc.subject | Transfer Molding | en_US |
dc.subject | Package on-resistance | en_US |
dc.subject | Stray Inductance | en_US |
dc.subject | Junction to Case Thermal Resistance | en_US |
dc.title | Industrial 650V 4-Pack Super-Junction MOSFET Module using Transfer Molding Process | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/ECCE.2019.8912910 | - |
dc.relation.page | 4097-4101 | - |
dc.contributor.googleauthor | Lim, Jangmuk | - |
dc.contributor.googleauthor | Seong, Jihwan | - |
dc.contributor.googleauthor | Yoon, Sang Won | - |
dc.contributor.googleauthor | Kim, You Suk | - |
dc.contributor.googleauthor | Im, Hun-Chang | - |
dc.contributor.googleauthor | Hong, Won Sik | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF AUTOMOTIVE ENGINEERING | - |
dc.identifier.pid | swyoon | - |
dc.identifier.orcid | https://orcid.org/0000-0002-0201-8031 | - |
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