Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박원일 | - |
dc.date.accessioned | 2020-08-26T06:18:01Z | - |
dc.date.available | 2020-08-26T06:18:01Z | - |
dc.date.issued | 2019-09 | - |
dc.identifier.citation | KOREAN JOURNAL OF METALS AND MATERIALS, v. 57, no. 9, Page. 582-588 | en_US |
dc.identifier.issn | 1738-8228 | - |
dc.identifier.issn | 2288-8241 | - |
dc.identifier.uri | http://kjmm.org/journal/view.php?doi=10.3365/KJMM.2019.57.9.582 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/152587 | - |
dc.description.abstract | Chemical mechanical polishing (CMP) of bulk AIN was performed with colloidal silica slurry at pH 9 for different times. The result shows that colloidal silica slurry at pH 9, which has the relatively high surface charge of -50.7 mV is most stable, and it was selected as chemically optimum condition in this study. The ultra-smooth surface was shown in CMP 90 min with the roughness average (Ra) value of 0.172 nm. It was demonstrated that the damaged layers including subsurface defects and micro scratches in the whole machining process were successfully removed and atomically flat surface can be shown. With increasing process time, the zeta potential and mean particle size of the colloidal silica decreased and increased by -35.07 mV and 143.4 nm, respectively. While the silica particles agglomerated and densely packed slurry particles were formed by mechanical shearing. These increased the Ra value above 0.5 nm of AIN substrate and generated additional surface damages. In terms of the surface chemistry, the carbon compounds and organic impurities adsorbed on the substrate during mechanical polishing (MP) can be removed and aluminum oxide-hydroxide; AlOOH and Al(OH)(3) were observed during the CMP. It was determined that the chemically polished AIN substrate was continuously hydrated with generating the AlOOH and Al(OH)(3) on the surface. | en_US |
dc.description.sponsorship | This work was supported by the Industrial Strategic Technology Development program funded by the Ministry of Trade Industry & Energy, KOREA (Project No. 10043791). | en_US |
dc.language.iso | en | en_US |
dc.publisher | KOREAN INST METALS MATERIALS | en_US |
dc.subject | aluminum nitride | en_US |
dc.subject | chemical mechanical polishing | en_US |
dc.subject | colloidal silica | en_US |
dc.subject | material removal rate | en_US |
dc.subject | surface chemistry | en_US |
dc.subject | slurry agglomeration | en_US |
dc.title | Optimization of the CMP Process with Colloidal Silica Performance for Bulk MN Single Crystal Substrate | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.3365/KJMM.2019.57.9.582 | - |
dc.relation.page | 582-588 | - |
dc.relation.journal | KOREAN JOURNAL OF METALS AND MATERIALS | - |
dc.contributor.googleauthor | Kang, Hyo Sang | - |
dc.contributor.googleauthor | Lee, Joo Hyung | - |
dc.contributor.googleauthor | Park, Jae Hwa | - |
dc.contributor.googleauthor | Lee, Hee Ae | - |
dc.contributor.googleauthor | Park, Won Il | - |
dc.contributor.googleauthor | Kang, Seung Min | - |
dc.contributor.googleauthor | Yi, Sung Chul | - |
dc.relation.code | 2019036715 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | wipark | - |
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