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dc.contributor.author최병덕-
dc.date.accessioned2020-07-28T06:13:38Z-
dc.date.available2020-07-28T06:13:38Z-
dc.date.issued2019-06-
dc.identifier.citationJOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v. 19, no. 3, Page. 260-269en_US
dc.identifier.issn1598-1657-
dc.identifier.issn2233-4866-
dc.identifier.urihttp://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE08746100&language=ko_KR-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/151916-
dc.description.abstractInvasive physical attacks on integrated circuits (ICs), such as de-packaging, focused ion beam (FIB) chip editing, and micro-probing attempts, constitute security threats for chips with potentially valuable information, such as smart cards. Using a state-of-the-art circuit-editing technique, an attacker can remove an IC's top metal layer, leaving its secure information exposed to micro-probing attacks. Security ICs can be seriously threatened by such attacks and thus require on-chip countermeasures. Conventional active shields, however, have difficulty coping with physical attacks based on FIB chip editing (i.e., bypassing the top metal shield). This study presents a novel countermeasure against physical attacks based on the use of a reconfigurable metal shield for both top metal removal and micro-probing attack detection. This shield consists of two circuits: an FIB chip editing detection circuit consisting of a random number generator and a micro-probing attempt detection circuit consisting of two conditionally synchronized ring oscillators. Both circuits share a randomly reconfigured top metal shield, which represents a promising solution for security against state-of-the-art invasive attacks.en_US
dc.description.sponsorshipThis work was supported by Samsung Research Funding Center of Samsung Electronics under Project Number SRFC-IT1601-01. This research was also supported by IDEC.en_US
dc.language.isoenen_US
dc.publisherIEEK PUBLICATION CENTERen_US
dc.subjectTerms-Active shielden_US
dc.subjecthardware securityen_US
dc.subjectinvasive attacken_US
dc.subjectmicro-probing attempten_US
dc.subjecttop metal shielden_US
dc.titleSecure Integrated Circuit with Physical Attack Detection based on Reconfigurable Top Metal Shielden_US
dc.typeArticleen_US
dc.relation.no3-
dc.relation.volume19-
dc.identifier.doi10.5573/JSTS.2019.19.3.260-
dc.relation.page260-269-
dc.relation.journalJOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE-
dc.contributor.googleauthorMun, Yeongjin-
dc.contributor.googleauthorKim, Hyungseup-
dc.contributor.googleauthorLee, Byeoncheol-
dc.contributor.googleauthorHan, Kwonsang-
dc.contributor.googleauthorKim, Jaesung-
dc.contributor.googleauthorKim, Ji-Hoon-
dc.contributor.googleauthorChoi, Byong-Deok-
dc.contributor.googleauthorKim, Dong Kyue-
dc.contributor.googleauthorKo, Hyoungho-
dc.relation.code2019038164-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidbdchoi-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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