Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 안유민 | - |
dc.date.accessioned | 2020-03-12T04:30:46Z | - |
dc.date.available | 2020-03-12T04:30:46Z | - |
dc.date.issued | 2004-03 | - |
dc.identifier.citation | MATERIALS SCIENCE FORUM, v. 449-452, Page. 393-396 | en_US |
dc.identifier.issn | 0255-5476 | - |
dc.identifier.issn | 1662-9760 | - |
dc.identifier.issn | 1662-9752 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/136793 | - |
dc.identifier.uri | https://www.scientific.net/MSF.449-452.393 | - |
dc.description.abstract | Electroless copper plating was investigated for the electronics applications, such as a metallization for ULSI and MEMS etc. The role of electrolyte composition on the kinetics and mechanism of the electroless copper deposition process was described. Electrochemical techniques were employed for the investigations. The mixed potential and current were determined and then those were compared with experimental deposition rate. The kinetics is strongly influenced by the pretreatment and additive concentrations. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | TRANS TECH PUBLICATIONS LTD | en_US |
dc.subject | Additive | en_US |
dc.subject | Electroless Copper Plating | en_US |
dc.subject | Mixed Potential | en_US |
dc.title | Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.449-452.393 | - |
dc.relation.journal | MATERIALS SCIENCE FORUM | - |
dc.contributor.googleauthor | Kim, Dae Geun | - |
dc.contributor.googleauthor | Bae, Jin Soo | - |
dc.contributor.googleauthor | Lee, Jae Ho | - |
dc.contributor.googleauthor | Kim, Yang Do | - |
dc.contributor.googleauthor | Ahn, Yoo Min | - |
dc.relation.code | 2012206495 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | ahnym | - |
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