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dc.contributor.author송윤흡-
dc.date.accessioned2019-12-07T16:37:40Z-
dc.date.available2019-12-07T16:37:40Z-
dc.date.issued2018-04-
dc.identifier.citationAPPLIED PHYSICS LETTERS, v. 112, no. 18, Article no. 183504en_US
dc.identifier.issn0003-6951-
dc.identifier.issn1077-3118-
dc.identifier.urihttps://aip.scitation.org/doi/10.1063/1.5029327-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/118161-
dc.description.abstractPhase-change random access memory (PCRAM) is enabled by a large resistance contrast between amorphous and crystalline phases upon reversible switching between the two states. Thus, great efforts have been devoted to identifying potential phase-change materials (PCMs) with large electrical contrast to realize a more accurate reading operation. In contrast, although the truly dominant resistance in a scaled PCRAM cell is contact resistance, less attention has been paid toward the investigation of the contact property between PCMs and electrode metals. This study aims to propose a non-bulk-resistance-dominant PCRAM whose resistance is modulated only by contact. The contact-resistance-dominated PCM exploited here is N-doped Cr2Ge2Te6 (NCrGT), which exhibits almost no electrical resistivity difference between the two phases but exhibits a typical switching behavior involving a three-order-of-magnitude SET/RESET resistance ratio owing to its large contact resistance contrast. The conduction mechanism was discussed on the basis of current-voltage characteristics of the interface between the NCrGT and the W electrode. Published by AIP Publishing.en_US
dc.description.sponsorshipThis work was supported by KAKENHI (Grant No. 15H04113) and JSPS and KPFK under the Japan-Korea Basic Scientific Cooperation Program. This work was also supported by the Kato Foundation for Promotion of Science.en_US
dc.language.isoen_USen_US
dc.publisherAMER INST PHYSICSen_US
dc.subjectGE2SB2TE5 FILMSen_US
dc.subjectDATA-STORAGEen_US
dc.titleContact resistance change memory using N-doped Cr2Ge2Te6 phase-change material showing non-bulk resistance changeen_US
dc.typeArticleen_US
dc.relation.no18-
dc.relation.volume112-
dc.identifier.doi10.1063/1.5029327-
dc.relation.page1-5-
dc.relation.journalAPPLIED PHYSICS LETTERS-
dc.contributor.googleauthorShuang, Y.-
dc.contributor.googleauthorSutou, Y.-
dc.contributor.googleauthorHatayama, S.-
dc.contributor.googleauthorShindo, S.-
dc.contributor.googleauthorSong, Y. H.-
dc.contributor.googleauthorAndo, D.-
dc.contributor.googleauthorKoike, J.-
dc.relation.code2018003212-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidyhsong2008-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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