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dc.contributor.author박준홍-
dc.date.accessioned2019-12-04T01:04:27Z-
dc.date.available2019-12-04T01:04:27Z-
dc.date.issued2018-01-
dc.identifier.citationAPPLIED SCIENCES-BASEL, v. 8, no. 2, Article no. 195en_US
dc.identifier.issn2076-3417-
dc.identifier.urihttps://www.mdpi.com/2076-3417/8/2/195-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/116957-
dc.description.abstractThe dynamic properties of inkjet-printed Ag thin films on flexible substrates were measured using flexural wave propagation. The Ag nanoparticle suspension was inkjet-printed on polyimide (PI), silicon wafer, and glass. The effects of flexible substrates on the dynamic properties of the films were investigated. Beam-shaped Ag-printed substrates were fabricated by pico-second laser pulse cutting. The wave approach was presented to analyze the vibrations of the thin film on the substrates. The Young's modulus and loss factor of the Ag thin films with the substrates were represented by the combined bending stiffness of the bilayer beam. The vibration response of the base-excited cantilever was measured using an accelerometer and laser Doppler vibrometer (LDV). Vibration transfers were analyzed to obtain dynamic characteristics of the Ag-printed bilayer beam. The substrate affects the reduction of the Ag thin film thickness during the sintering process and surface roughness of the film. The proposed method based on the wave approach allows measurement of the dynamic properties regardless of the ratio of the modulus between the thin film and substrate.en_US
dc.description.sponsorshipThis research was supported by a Grant (17RTRP-B072484-05) from the Railroad Technology Research Program funded by the Ministry of Land, Infrastructure and Transport of the Korean government.en_US
dc.language.isoen_USen_US
dc.publisherMDPIen_US
dc.subjectinkjet printingen_US
dc.subjectthin-filmen_US
dc.subjectdynamic propertyen_US
dc.subjectflexural waveen_US
dc.subjectcantileveren_US
dc.titleEffect of Substrates on the Dynamic Properties of Inkjet-Printed Ag Thin Filmsen_US
dc.typeArticleen_US
dc.relation.no2-
dc.relation.volume8-
dc.identifier.doi10.3390/app8020195-
dc.relation.page1-9-
dc.relation.journalAPPLIED SCIENCES-BASEL-
dc.contributor.googleauthorKim, Deokman-
dc.contributor.googleauthorKwak, Yunsang-
dc.contributor.googleauthorPark, Junhong-
dc.relation.code2018009765-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.pidparkj-


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