Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김학성 | - |
dc.date.accessioned | 2019-11-25T06:22:16Z | - |
dc.date.available | 2019-11-25T06:22:16Z | - |
dc.date.issued | 2017-05 | - |
dc.identifier.citation | NANOTECHNOLOGY, v. 28, no. 20, Article no. 205205 | en_US |
dc.identifier.issn | 0957-4484 | - |
dc.identifier.issn | 1361-6528 | - |
dc.identifier.uri | https://iopscience.iop.org/article/10.1088/1361-6528/aa6cda | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/114165 | - |
dc.description.abstract | In this work, bimodal Cu nano-inks composed of two different sizes of Cu nanoparticles (NPs) (40 and 100 nm in diameter) were successfully sintered with a multi-pulse flashlight sintering technique. Bimodal Cu nano-inks were fabricated and printed with various mixing ratios and subsequently sintered by a flash light sintering method. The effects of the flashlight sintering conditions, including irradiation energy and pulse number, were investigated to optimize the sintering conditions. A detailed mechanism of the sintering of bimodal Cu nano-ink was also studied via real-time resistance measurement during the sintering process. The sintered Cu nano-ink films were characterized using x-ray photoelectron spectroscopy and scanning electron microscopy. From these results, it was found that the optimal ratio of 40-100 nm NPs was found to be 25:75 wt%, and the optimal multi-pulse flash light sintering condition (irradiation energy: 6 J cm(-2), and pulse duration: 1 ms, off-time: 4 ms, and pulse number: 5) was found. The optimally sintered Cu nano-ink film exhibited the lowest resistivity of 5.68 mu Omega cm and 5B adhesion level. | en_US |
dc.description.sponsorship | This research was supported by the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2012R1A6A1029029). This work was supported by NRF, funded by the Ministry of Education (2015R1D1A1A09058418). Also, this work was supported by NRF, funded by the Korean Government (MEST) (2013M2A2A9043280). | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | IOP PUBLISHING LTD | en_US |
dc.subject | printed electronics | en_US |
dc.subject | bimodal Cu nanoparticles | en_US |
dc.subject | flash light sintering | en_US |
dc.subject | multi-pulse sintering | en_US |
dc.subject | adhesion strength and resistivity | en_US |
dc.title | Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes | en_US |
dc.type | Article | en_US |
dc.relation.no | 205205 | - |
dc.relation.volume | 28 | - |
dc.identifier.doi | 10.1088/1361-6528/aa6cda | - |
dc.relation.page | 1-12 | - |
dc.relation.journal | NANOTECHNOLOGY | - |
dc.contributor.googleauthor | Yu, Myeong-Hyeon | - |
dc.contributor.googleauthor | Joo, Sung-Jun | - |
dc.contributor.googleauthor | Kim, Hak-Sung | - |
dc.relation.code | 2017001039 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kima | - |
dc.identifier.orcid | http://orcid.org/0000-0002-6076-6636 | - |
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