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dc.contributor.author조성호-
dc.date.accessioned2019-11-25T01:50:17Z-
dc.date.available2019-11-25T01:50:17Z-
dc.date.issued2017-05-
dc.identifier.citationACS APPLIED MATERIALS & INTERFACES, v. 9, no. 22, page. 18918-18924en_US
dc.identifier.issn1944-8244-
dc.identifier.issn1944-8252-
dc.identifier.urihttps://pubs.acs.org/doi/10.1021/acsami.7b02581-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/113965-
dc.description.abstractAlthough three-dimensional (3D) printing has recently emerged as a technology to potentially bring about the next industrial revolution, the limited selection of usable materials restricts its use to simple prototyping. In particular, metallic 3D printing with submicrometer spatial resolution is essential for the realization of 3D-printed electronics. Herein, a meniscus-guided 3D printing method that exploits a low-viscosity (similar to 7 mPa.s) silver nanoparticle (AgNP) ink meniscus with Newtonian fluid characteriftics (which is compatible with conventional inkjet printers) to fabricate 3D silver microarchitectures is reported. Poly(acrylic acid)-capped AgNP ink that exhibits a continuous ink flow through a confined nozzle without aggregation is designed in this study. Guiding the ink meniscus with controlled direction and speed enables both vertical pulling and layer-by-layer processing, resulting in the creation of 3D microobjects with designed shapes other than those for simple wiring. Various highly conductive (>10(4) S.cm(-1)) 3D metallic patterns are demonstrated for applications in electronic devices. This research 18 expected to widen the range of Materials that can be employed in 3D printing technology, with the aim of moving 3D printing beyond prototyping and into real manufacturing platforms for future electronics.en_US
dc.description.sponsorshipThis research was supported by Korea Electrotechnology Research Institute (KERI) Primary research program through the National Research Council of Science & Technology (NST), funded by the Ministry of Science, ICT and Future Planning (MSIP) (No. 17-12-N0101-29), and by the Seed Fund for Basic Research, funded by the University of Hong Kong (201611159002).en_US
dc.language.isoen_USen_US
dc.publisherAMER CHEMICAL SOCen_US
dc.subject3D printingen_US
dc.subject3D-piinted electronicsen_US
dc.subjectmeniscus guided printingen_US
dc.subjectsilver microarchitectureen_US
dc.subjectNewtonian fluid inken_US
dc.titleThree-dimensional Printing of Silver Microarchitectures Using Newtonian Nanoparticle Inksen_US
dc.typeArticleen_US
dc.relation.volumeDOI: 10.1021/acsami.7b02581-
dc.identifier.doi10.1021/acsami.7b02581-
dc.relation.page1-7-
dc.relation.journalACS APPLIED MATERIALS & INTERFACES-
dc.contributor.googleauthorLee, Sanghyeon-
dc.contributor.googleauthorKim, Jung Hyun-
dc.contributor.googleauthorWajahat, Muhammad-
dc.contributor.googleauthorJeong, Hwakyung-
dc.contributor.googleauthorChang, Won Suk-
dc.contributor.googleauthorCho, Sung Ho-
dc.contributor.googleauthorKim, Ji Tae-
dc.contributor.googleauthorSeol, Seung Kwon-
dc.relation.code2017001478-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.piddragon-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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