Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박관규 | - |
dc.date.accessioned | 2019-11-22T01:49:55Z | - |
dc.date.available | 2019-11-22T01:49:55Z | - |
dc.date.issued | 2017-03 | - |
dc.identifier.citation | JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, v. 141, no. 3, page. EL205-EL209 | en_US |
dc.identifier.issn | 0001-4966 | - |
dc.identifier.issn | 1520-8524 | - |
dc.identifier.uri | https://asa.scitation.org/doi/10.1121/1.4976193 | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/113447 | - |
dc.description.abstract | Fingerprint imaging has been widely used in biometric identification systems. This work presents a photoacoustic (PA) fingerprint imaging system that provides acoustic resolution using a pulsed laser and focused ultrasound transducer operating as a receiver. This PA system can measure dry fingers with a wide-range laser field based on the differences in the ultrasound coupling between the fingertip areas contacting and not contacting a solid plate. To demonstrate and validate the image accuracy of the PA system, PA fingerprint images were compared to images captured using a pulse-echo ultrasound system and an ink-pressed fingerprint scan. (C) 2017 Acoustical Society of America | en_US |
dc.description.sponsorship | This work was supported by the research fund of Hanyang University (Grant No. HY-2013). | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | ACOUSTICAL SOC AMER AMER INST PHYSICS | en_US |
dc.subject | IDENTIFICATION | en_US |
dc.subject | CIRCUIT | en_US |
dc.subject | PROBE | en_US |
dc.title | Fingerprint imaging of dry finger using photoacoustics | en_US |
dc.type | Article | en_US |
dc.relation.no | 3 | - |
dc.relation.volume | 141 | - |
dc.identifier.doi | 10.1121/1.4976193 | - |
dc.relation.page | 205-209 | - |
dc.relation.journal | JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA | - |
dc.contributor.googleauthor | Choi, Won Young | - |
dc.contributor.googleauthor | Park, Kwan Kyu | - |
dc.relation.code | 2017002120 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MECHANICAL ENGINEERING | - |
dc.identifier.pid | kwankyu | - |
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