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dc.contributor.author소홍윤-
dc.date.accessioned2019-11-21T04:24:50Z-
dc.date.available2019-11-21T04:24:50Z-
dc.date.issued2017-03-
dc.identifier.citationMICROELECTRONIC ENGINEERING, v. 173, page. 54-57en_US
dc.identifier.issn0167-9317-
dc.identifier.urihttps://www.sciencedirect.com/science/article/abs/pii/S0167931717301259?via%3Dihub-
dc.identifier.urihttps://repository.hanyang.ac.kr/handle/20.500.11754/113098-
dc.description.abstractThis work presents a simple and rapid lithography-free (i.e., maskless) microfabrication process for strain-sensitive aluminum gallium nitride (AlGaN)/GaN sensors. We microfabricated an AlGaN/GaN strain sensor through laser ablation of the underlying Si (111) substrate and direct bonding of aluminum wires to the sensor surface, creating a Schottky contact to the two-dimensional electron gas (2DEG). We measured the sensor's current-voltage operation while displacing the center of the membrane up to approximately 106 pm and characterized its sensitivity at from 0.5 to 2 V bias (i.e.,similar to 5 to 100 nA/mu m). This work advances the development of AlGaN/GaN-on-Si microelectronics (e.g., pressure sensors, accelerometers, and gyroscopes) using the simplified fabrication process, which eliminates lithography, metallization, and etching, and reduces the manufacturing time (5 min) and cost as well as the need for cleanroom environments. (C) 2017 Elsevier B.V. All rights reserved.en_US
dc.description.sponsorshipThis work was supported in part by the National Science Foundation Engineering Research Center for Power Optimization of Electro Thermal Systems under Grant EEC-1449548 and in part by the National Science Foundation Graduate Research Fellowship under Grant DGE-114747. The authors are grateful for support from the Stanford Nanofabrication Facility (SNF) and Stanford Nano Shared Facilities (SNSF), supported by the National Science Foundation under award ECCS-1542152, at Stanford University.en_US
dc.language.isoen_USen_US
dc.publisherELSEVIER SCIENCE BVen_US
dc.subjectGallium nitrideen_US
dc.subjectMicrofabricationen_US
dc.subjectStrain sensoren_US
dc.subjectLaser ablationen_US
dc.subjectDirect wire bondingen_US
dc.titleLithography-free microfabrication of AlGaN/GaN 2DEG strain sensors using laser ablation and direct wire bondingen_US
dc.typeArticleen_US
dc.relation.volume173-
dc.identifier.doi10.1016/j.mee.2017.03.012-
dc.relation.page54-57-
dc.relation.journalMICROELECTRONIC ENGINEERING-
dc.contributor.googleauthorDowling, Karen M.-
dc.contributor.googleauthorSo, Hongyun-
dc.contributor.googleauthorToor, Anju-
dc.contributor.googleauthorChapin, Caitlin A.-
dc.contributor.googleauthorSenesky, Debbie G.-
dc.relation.code2017001998-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.pidhyso-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
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