Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 오성근 | - |
dc.date.accessioned | 2019-11-20T08:56:52Z | - |
dc.date.available | 2019-11-20T08:56:52Z | - |
dc.date.issued | 2017-02 | - |
dc.identifier.citation | JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v. 46, page. 289-297 | en_US |
dc.identifier.issn | 1226-086X | - |
dc.identifier.issn | 1876-794X | - |
dc.identifier.uri | https://www.sciencedirect.com/science/article/pii/S1226086X1630421X?via%3Dihub | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/112664 | - |
dc.description.abstract | Silica nanoparticles modified with aminophenyl group were fabricated through two-step sol-gel process under the weak acidic condition due to fast hydrolysis and condensation rate of 3-aminophenyl trimethoxysilane. The aromatic groups on the surface of silica nanoparticles enhanced their dispersion stability in PAI film, and the amine groups were chemically bound with PAI by opening the cyclic imide through nucleophilic attack on carbonyl groups. The thermal stability and mechanical properties of the silica/PAI nanocomposite films have been improved by increasing the amount of modified silica nanoparticles up to 12 wt.%. Specially elongation showed a significant increase by 42.37%. (C) 2016 The Korean Society of Industrial and Engineering Chemistry. Published by Elsevier B.V. All rights reserved. | en_US |
dc.description.sponsorship | This research was supported by Korea Electrotechnology Research Institute (KERI) research program funded by Green Energy Innovative Expert (GENIE) (No. 14-02-N0201-07). | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | ELSEVIER SCIENCE INC | en_US |
dc.subject | Surface-modified silica nanoparticles | en_US |
dc.subject | p-Aminophenyltrimethoxysilane | en_US |
dc.subject | Nanocomposite films | en_US |
dc.subject | Thermal stability | en_US |
dc.subject | Mechanical properties | en_US |
dc.title | Dispersion of surface-modified silica nanoparticles in polyamide-imide (PAI) films for enhanced mechanical and thermal properties | en_US |
dc.type | Article | en_US |
dc.relation.volume | 46 | - |
dc.identifier.doi | 10.1016/j.jiec.2016.10.042 | - |
dc.relation.page | 289-297 | - |
dc.relation.journal | JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY | - |
dc.contributor.googleauthor | Kang, Taeho | - |
dc.contributor.googleauthor | Lee, John Hwan | - |
dc.contributor.googleauthor | Oh, Seong-Geun | - |
dc.relation.code | 2017007147 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DEPARTMENT OF CHEMICAL ENGINEERING | - |
dc.identifier.pid | seongoh | - |
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