Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2019-11-11T04:32:31Z | - |
dc.date.available | 2019-11-11T04:32:31Z | - |
dc.date.issued | 2005-11 | - |
dc.identifier.citation | JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v. 47, No. 9(3), Page. 530-534 | en_US |
dc.identifier.issn | 0374-4884 | - |
dc.identifier.issn | 1976-8524 | - |
dc.identifier.uri | http://www.jkps.or.kr/journal/view.html?uid=7401&vmd=Full | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/112049 | - |
dc.description.abstract | We investigated the possibility of using hot embossing for polymer-based flexible substrates. A Si mold had a mixture of patterns from 1 mu m to 500 mu m width and was imprinted on various thicknesses of PMMA. To obtain a good release process between the mold and replica, an antistiction layer was coated on the mold. All procedures were conducted in a clean room to ensure a particle-free result. Printing conditions were optimized as functions of process pressure and temperature plotted and calculated. Thin layers need a higher temperature and pressure than thick layers. The mold structures were successfully replicated into a PMMA substrate over the area of a 4-inch wafer. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | 한국물리학회 | en_US |
dc.title | Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA | en_US |
dc.type | Article | en_US |
dc.relation.journal | JOURNAL OF THE KOREAN PHYSICAL SOCIETY | - |
dc.contributor.googleauthor | Cha, NG | - |
dc.contributor.googleauthor | Park, CH | - |
dc.contributor.googleauthor | Lim, HW | - |
dc.contributor.googleauthor | Park, JG | - |
dc.relation.code | 2009205987 | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING | - |
dc.identifier.pid | jgpark | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.