Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 어영선 | - |
dc.date.accessioned | 2019-07-03T07:23:40Z | - |
dc.date.available | 2019-07-03T07:23:40Z | - |
dc.date.issued | 2007-10 | - |
dc.identifier.citation | ISOCC 2007 Conference, Page. 513 - 516 | en_US |
dc.identifier.uri | http://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE01789668&language=ko_KR | - |
dc.identifier.uri | https://repository.hanyang.ac.kr/handle/20.500.11754/107089 | - |
dc.description.abstract | The frequency-variant characteristics of a pair of package power and ground net are experimentally investigated and modeled by using frequency-variant grid-type equivalent circuits, where each cell of the grid is modeled with vertically stacked RLC-ladder circuits. The test patterns are characterized by using TDR/TDT and VNA. Based on the experimental characterizations, not only are material constants and circuit model parameters determined, but also the conductor roughness and other frequency-variant effects are modeled. It is shown that the SPICE-based circuit simulation using the proposed circuit model has an excellent agreement with the measurement data in the range of 100MHz ~ 15GHz. Then, it is also shown that the various types of package performance evaluations can be very efficiently as well as accurately achieved with the proposed technique. | en_US |
dc.language.iso | ko_KR | en_US |
dc.publisher | 대한전자공학회 | en_US |
dc.subject | Power distribution net | en_US |
dc.subject | transmission line | en_US |
dc.subject | Frequency variant circuit model | en_US |
dc.subject | Skin effect | en_US |
dc.subject | BGA Package | en_US |
dc.subject | S-parameters | en_US |
dc.title | High-frequency-measurement-based IC package performance evaluation | en_US |
dc.type | Article | en_US |
dc.contributor.googleauthor | Kim, Dongchul | - |
dc.contributor.googleauthor | Lee, Jung-A | - |
dc.contributor.googleauthor | Eo, Yungseon | - |
dc.sector.campus | E | - |
dc.sector.daehak | COLLEGE OF ENGINEERING SCIENCES[E] | - |
dc.sector.department | DIVISION OF ELECTRICAL ENGINEERING | - |
dc.identifier.pid | eo | - |
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