Efficient Pre-Bond Testing of TSV Defects Based on IEEE std. 1500 Wrapper Cells
- Title
- Efficient Pre-Bond Testing of TSV Defects Based on IEEE std. 1500 Wrapper Cells
- Author
- 박성주
- Keywords
- TSV defect; IEEE std. 1500 wrapper cell; load capacitance; delay test; pre-bond test; THROUGH-SILICON VIAS; DELAY TEST; ICS
- Issue Date
- 2016-04
- Publisher
- 대한전자공학회
- Citation
- JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, v. 16, No. 2, Page. 226-235
- Abstract
- The yield of 3D stacked IC manufacturing improves with the pre-bond integrity testing of through silicon vias (TSVs). In this paper, an efficient pre-bond test method is presented based on IEEE std. 1500, which can precisely diagnose any happening of TSV defects. The IEEE std. 1500 wrapper cells are augmented for the proposed method. The pre-bond TSV test can be performed by adjusting the driving strength of TSV drivers and the test clock frequency. The experimental results show the advantages of the proposed approach.
- URI
- http://www.dbpia.co.kr/Journal/ArticleDetail/NODE06663221https://repository.hanyang.ac.kr/handle/20.500.11754/102274
- ISSN
- 1598-1657; 2233-4866
- DOI
- 10.5573/JSTS.2016.16.2.226
- Appears in Collections:
- COLLEGE OF COMPUTING[E](소프트웨어융합대학) > COMPUTER SCIENCE(소프트웨어학부) > Articles
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