| 2005-07 | Particle Adhesion and Removal on EUV Mask Layers During Wet Cleaning | 박진구 |
| 2017-12 | Particle Deposition and Adhesion | 박진구 |
| 2001-11 | Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH4OH Solutions with an Added Surfactant | 박진구 |
| 2002-10 | Passivation and Etching of Wafer Surfaces in HF-H2O2-IPA Solutions | 박진구 |
| 2006-03 | PECVD를 이용한 금속 스탬프용 점착방지막 형성과 특성 평가 | 박진구 |
| 2001-11 | PECVD와 ICP에 의해 증착된 불화유기박막의 나노트라이볼러지 특성 비교분실 | 박진구 |
| 2003-04 | Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization | 박진구 |
| 2001-11 | Physical and Chemical Characterization of Recycled Oxide CMP Slurry | 박진구 |
| 2001-08 | Physical and chemical characterization of reused oxide Chemical Mechanical Planarization slurry | 박진구 |
| 2001-03 | Physical and Chemical Characterization of Reused Oxide Chemical Mechanical Planarization Slurry | 박진구 |
| 2002-11 | Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filterations | 박진구 |
| 2002-11 | Point of use regeneration of oxide chemical mechanical planarization slurry by filtrations | 박진구 |
| 2005-07 | Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA) | 박진구 |
| 2006-12 | Post W CMP cleaning without HF cleans | 박진구 |
| 2016-05 | Post-Cleaning Effect on a HfO2 Gate Stack Using a NF3/NH3 Plasma | 박진구 |
| 2007-03 | Post-CMP Cleaning | 박진구 |
| 2019-01 | Post-CMP Cleaning of InGaAs Surface for the Removal of Nanoparticle Contaminants for Sub-10nm Device Applications | 박진구 |
| 2019-05 | Preface-JSS Focus Issue on CMP for Sub-10 nm Technologies | 박진구 |
| 1999-02 | Preparation and characterization of perfluoro-organic thin films on aluminium | 박진구 |
| 2017-01 | Preparation of a high hydrophobic aluminium surface by double zincating process | 박진구 |
