Browsing byAuthor박진구

Jump to:
All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
  • Sort by:
  • In order:
  • Results/Page
  • Authors/Record:

Showing results 240 to 259 of 352

Issue DateTitleAuthor(s)
2013-04On the mechanism of material removal by fixed abrasive lapping of various glass substrates박진구
2013-04On the mechanism of material removal by fixed abrasive lapping of various glass substrates박진구
2013-04Optimal Pressure and Temperature Conditions for Deposition of FOTS Thin Films Suitable for Anti-Stiction Layers박진구
2013-04Optimal Pressure and Temperature Conditions for Deposition of FOTS Thin Films Suitable for Anti-Stiction Layers박진구
2010-12Optimization of CO 2 gas cluster generation for cleaning application박진구
2010-12Optimization of DIO 3with megasonic cleaning of Ru capped EUVL mask for effective carbon contaminant removal박진구
2005-11Optimizing the Plasma Deposition Process Parameters of Antistiction Layers using a DOE(Design of Experiment)박진구
2005-07Particle Adhesion and Removal on EUV Mask Layers During Wet Cleaning박진구
2017-12Particle Deposition and Adhesion박진구
2001-11Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH4OH Solutions with an Added Surfactant박진구
2002-10Passivation and Etching of Wafer Surfaces in HF-H2O2-IPA Solutions박진구
2006-03PECVD를 이용한 금속 스탬프용 점착방지막 형성과 특성 평가박진구
2001-11PECVD와 ICP에 의해 증착된 불화유기박막의 나노트라이볼러지 특성 비교분실박진구
2003-04Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization박진구
2001-11Physical and Chemical Characterization of Recycled Oxide CMP Slurry박진구
2001-08Physical and chemical characterization of reused oxide Chemical Mechanical Planarization slurry박진구
2001-03Physical and Chemical Characterization of Reused Oxide Chemical Mechanical Planarization Slurry박진구
2002-11Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filterations박진구
2002-11Point of use regeneration of oxide chemical mechanical planarization slurry by filtrations박진구
2005-07Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA)박진구

BROWSE