| 2012-02 | Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography | 박진구 |
| 2005-06 | Fabrication of metal line on plastic substrate by hot embossing and CMP process | 박진구 |
| 2006-11 | Fabrication of nano- and micro-scale UV imprint stamp using diamond-like carbon coating technology | 박진구 |
| 2005-06 | Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process | 박진구 |
| 2018-10 | Fabrication of Stainless Steel Metal Mask with Electrochemical Fabrication Method and Its Improvement in Dimensional Uniformity | 박진구 |
| 2007-11 | Fabrication of stainless steel mold using electro chemical fabrication (ECF) method for microfluidic biochip | 박진구 |
| 2008-06 | Fabrication of stainless steel mold using electrochemical fabrication method for microfluidic biochip | 박진구 |
| 2013-04 | Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography | 박진구 |
| 2013-04 | Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography | 박진구 |
| 2021-02 | Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND | 박진구 |
| 2011-02 | Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation | 박진구 |
| 2011-02 | Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation | 박진구 |
| 2013-05 | Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance | 박진구 |
| 2013-05 | Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance | 박진구 |
| 2020-02 | Hybrid DHF and N-2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 박진구 |
| 2020-02 | Hybrid DHF and N2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 박진구 |
| 2011-07 | Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP | 박진구 |
| 2011-07 | Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP | 박진구 |
| 2013-11 | The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide | 박진구 |
| 2017-03 | Impact of non-uniform wrinkles for a multi-stack pellicle in EUV lithography | 박진구 |
