Repository at Hanyang University

Browsing byAuthor박진구

Jump to:
All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
가 나 다 라 마 바 사 아 자 차 카 타 파 하
  • Sort by:
  • In order:
  • Results/Page
  • Authors/Record:

Showing results 101 to 120 of 352

Issue DateTitleAuthor(s)
2008-12Effect of Ozone Supply Methods on PRE in Alkaline Ozone Solutions박진구
2015-10Effect of Particle Contamination on Extreme Ultraviolet (EUV) Mask and Megasonic Cleaning Process for Its Removal박진구
2014-12Effect of particle contamination on extreme ultraviolet (EUV) mask and megasonic cleaning process for its removal박진구
2007-10Effect of particle deposition and wet/dry cleaning methods on particle removal efficiency박진구
2016-05Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation박진구
2016-06Effect of pH and chemical mechanical planarization process conditions on the copper-benzotriazole complex formation박진구
2009-01Effect of pH in Ru Slurry with Sodium Periodate on Ru CMP박진구
2006-12Effect of polish by-products on copper chemical mechanical polishing behavior박진구
2006-12Effect of poly silicon wettability on polymeric residue contamination박진구
2009-10Effect of Polysilicon Wettability on Polishing and Organic Defects during CMP박진구
2010-02Effect of Processing Parameters, Antistiction Coatings, and Polymer Type when Injection Molding Microfeatures박진구
2011-10Effect of Pump Pulsation on Particle Contamination on Wafer Surface in Wet Cleaning System박진구
2010-12Effect of pump pulsation on particle contamination on wafer surface in wet cleaning system박진구
2011-01Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development박진구
2011-01Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development박진구
2011-01Effect of Rinse Process on Removal of Crown Type Defects during Photoresist Development박진구
2014-01Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing박진구
2014-03Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing박진구
2022-05Effect of Skin Layer on Brush Loading, Cross-Contamination, and Cleaning Performance during Post-CMP Cleaning박진구
2022-08Effect of Slurry Additives on Co-BTA Complex Stability and Inhibition Property During Co CMP Process박진구
123456789101118

BROWSE