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dc.contributor.author정진욱-
dc.date.accessioned2018-03-29T07:21:05Z-
dc.date.available2018-03-29T07:21:05Z-
dc.date.issued2014-01-
dc.identifier.citationThin Solid Films, 2013, 547, Pages 9-12en_US
dc.identifier.issn0040-6090-
dc.identifier.urihttps://ac.els-cdn.com/S0040609013009589/1-s2.0-S0040609013009589-main.pdf?_tid=spdf-3b6953d8-b394-41e3-8d91-4694a254c82d&acdnat=1519727284_9da4bdf51b2e0f23df3fad1ea312e57d-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/53772-
dc.description.abstractA method for measuring a transferred power to plasma is proposed in an inductively coupled plasma. Antenna currents are monitored when the plasma is turned on at a certain input power. The transferred power can be obtained by subtraction of the power at the same current when the plasma is turned off without inert gas, to the input power. This method is compared to the conventional method against various input powers and it is in good agreement. The circuit analysis of an impedance matching network is also discussed in this work.en_US
dc.language.isoenen_US
dc.publisherELSEVIER SCIENCE SA, PO BOX 564, 1001 LAUSANNE, SWITZERLANDen_US
dc.subjectInductively coupled plasmaen_US
dc.subjectPower transfer efficiencyen_US
dc.subjectDissipated power in systemen_US
dc.titleMethod for the measurement of transferred power to plasma in inductive discharges (vol 547, pg 9, 2013)en_US
dc.typeArticleen_US
dc.relation.volume551-
dc.identifier.doi10.1016/j.tsf.2013.05.114-
dc.relation.page206-206-
dc.relation.journalTHIN SOLID FILMS-
dc.contributor.googleauthorHwang, Hye-Ju-
dc.contributor.googleauthorKim, Young-Cheol-
dc.contributor.googleauthorChung, Chin-Wook-
dc.relation.code2014040221-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF ELECTRICAL AND BIOMEDICAL ENGINEERING-
dc.identifier.pidjoykang-
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COLLEGE OF ENGINEERING[S](공과대학) > ELECTRICAL AND BIOMEDICAL ENGINEERING(전기·생체공학부) > Articles
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