Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박종완 | - |
dc.date.accessioned | 2018-03-27T00:14:46Z | - |
dc.date.available | 2018-03-27T00:14:46Z | - |
dc.date.issued | 2014-11 | - |
dc.identifier.citation | SURFACE & COATINGS TECHNOLOGY, 259, p.98-101 | en_US |
dc.identifier.issn | 0257-8972 | - |
dc.identifier.uri | http://www.sciencedirect.com/science/article/pii/S0257897214004071 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/52781 | - |
dc.description.abstract | It is challenging to produce reliable Cu wiring on the nanometer scale for scaled-down devices. We studied the use of Co films deposited by plasma-enhanced atomic layer deposition (PEALD) using dicobalt hexacarbonyl tert-butylacetylene (CCTBA) as a precursor for Cu direct plating. Electrical properties of PEALD Co films of sub-20 nm thickness were determined by assessing continuities, morphologies, and impurities. To decrease the resistivity of Co films, a TaNx substrate was pre-treated with H-2 plasma and the flow rate of H-2 gas during CCTBA feeding and reactant feeding pulses was increased. Co films were deposited on a 3 nm-thick TaNx-covered SiO2 substrate with 24 nm-deep trenches, and Cu direct plating was successfully performed under conventional conditions. (C) 2014 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCIENCE SA | en_US |
dc.subject | Cobalt | en_US |
dc.subject | Atomic layer deposition | en_US |
dc.subject | Direct plating | en_US |
dc.subject | CCTBA | en_US |
dc.subject | Copper interconnect | en_US |
dc.title | Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating | en_US |
dc.type | Article | en_US |
dc.relation.volume | 259 | - |
dc.identifier.doi | 10.1016/j.surfcoat.2014.05.005 | - |
dc.relation.page | 98-101 | - |
dc.relation.journal | SURFACE & COATINGS TECHNOLOGY | - |
dc.contributor.googleauthor | Park, Jae-Hyung | - |
dc.contributor.googleauthor | Moon, Dae-Yong | - |
dc.contributor.googleauthor | Han, Dong-Suk | - |
dc.contributor.googleauthor | Kang, Yu-Jin | - |
dc.contributor.googleauthor | Shin, So-Ra | - |
dc.contributor.googleauthor | Jeon, Hyung-Tag | - |
dc.contributor.googleauthor | Park, Jong-Wan | - |
dc.relation.code | 2014039936 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | jwpark | - |
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