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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Results 31-40 of 264 (Search time: 0.003 seconds).
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Issue Date
Title
Author(s)
2003-04
나노 Imprinting 을 위한 몰드 제작에 관한 연구
박진구
2004-11
Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석
박진구
2004-11
The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal
박진구
2003-05
Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper
박진구
2020-02
Hybrid DHF and N2 jet spray cleaning for silicon nitride and metal layer DRAM patterns
박진구
2001-08
Physical and chemical characterization of reused oxide Chemical Mechanical Planarization slurry
박진구
2004-07
CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교
박진구
2004-07
In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP
박진구
2004-07
Cu CMP에서 Large sized particles이 연마속도에 미치는 영향
박진구
2002-10
The Effect of Mechanical Properties of Polishing Pads on Oxide CMP
박진구
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CMP
7
Particle removal
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Post CMP cleaning
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Cu CMP
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Megasonic cleaning
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Chemical mechanical planarization...
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Removal rate
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AFM
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Benzotriazole
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BTA
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2020 - 2023
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