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COLLEGE OF ENGINEERING SCIENCES[E](공학대학)
MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과)
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Title
Author(s)
2004-07
CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교
박진구
2010-09
Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry
박진구
2018-04
Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire
박진구
2007-00
Effect of slurry pH on poly silicon CMP
박진구
2008-01
Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing
박진구
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CMP
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Benzotriazole (BTA)
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Copper
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Cu disc
1
Cu wafer
1
Dynamic etching rate
1
Etch rate
1
Fe precipitation on colloidal silica
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Friction force
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Metal-resin composite plate
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-Date issued
2
2010 - 2018
2
2004 - 2009
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