2010-07 | Fabrication and Characterization of a 32 x 32 Array Digital Si-PIN X-ray Detector for a Single Photon Counting Image Sensor | 박진구 |
2012-03 | Fabrication of a hydrophobic/hydrophilic hybrid-patterned microarray chip and its application to a cancer marker immunoassay | 박진구 |
2005-11 | Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA | 박진구 |
2014-12 | Fabrication of bumping mask for flip-chip process on stainless steel using through mask electrochemical micro machining(TMEMM) | 박진구 |
2018-04 | Fabrication of high performance copper-resin lapping plate for sapphire: A combined 2-body and 3-body diamond abrasive wear on sapphire | 박진구 |
2005-09 | Fabrication of Hot Embossing Plastic Stamps for Microstructure | 박진구 |
2016-10 | Fabrication of hydrophobic/hydrophilic switchable aluminum surface using poly(N-isopropylacrylamide) | 박진구 |
2012-02 | Fabrication of Large-Area CoNi Mold for Nanoimprint Lithography | 박진구 |
2005-06 | Fabrication of metal line on plastic substrate by hot embossing and CMP process | 박진구 |
2006-11 | Fabrication of nano- and micro-scale UV imprint stamp using diamond-like carbon coating technology | 박진구 |
2005-06 | Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process | 박진구 |
2018-10 | Fabrication of Stainless Steel Metal Mask with Electrochemical Fabrication Method and Its Improvement in Dimensional Uniformity | 박진구 |
2007-11 | Fabrication of stainless steel mold using electro chemical fabrication (ECF) method for microfluidic biochip | 박진구 |
2008-06 | Fabrication of stainless steel mold using electrochemical fabrication method for microfluidic biochip | 박진구 |
2013-04 | Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography | 박진구 |
2021-02 | Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND | 박진구 |
2011-02 | Generation of Pad Debris during Oxide CMP Process and Its Role in Scratch Formation | 박진구 |
2013-05 | Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance | 박진구 |
2020-02 | Hybrid DHF and N-2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 박진구 |
2020-02 | Hybrid DHF and N2 jet spray cleaning for silicon nitride and metal layer DRAM patterns | 박진구 |
2011-07 | Hydrophobic Modification of Diamond Conditioner for Prevention of Particle Adhesion During Oxide CMP | 박진구 |
2015-08 | Impact of the non-uniform intensity distribution caused by a meshed pellicle of extreme ultraviolet lithography | 박진구 |
2004-07 | In-Situ Characterization of Electrochemical and Frictional Behaviors During Copper CMP | 박진구 |
2017-10 | Influence of a wrinkle in terms of critical dimension variation caused by transmission nonuniformity and a particle defect on extreme ultraviolet pellicle | 박진구 |
2012-10 | Influence of anionic polyelectrolyte addition on ceria dispersion behavior for quartz chemical mechanical polishing | 박진구 |
2016-09 | Influence of non-uniform intensity distribution of deformed pellicle for N7 patterning | 박진구 |
2003-05 | Interaction Forces Between Silica Particles and Wafer Surfaces during Chemical Mechanical Planarization of Copper | 박진구 |
2006-06 | Interfacial and electrokinetic characterization of IPA solutions related to semiconductor wafer drying and cleaning | 박진구 |
2014-11 | Investigation of Cu-BTA complex formation and removal on various Cu surface conditions | 박진구 |
2016-10 | Investigation of cu-BTA complex formation during Cu chemical mechanical planarization process | 박진구 |