Fabrication of metal line on plastic substrate by hot embossing and CMP process
- Title
- Fabrication of metal line on plastic substrate by hot embossing and CMP process
- Other Titles
- 핫 엠보싱 공정과 CMP 공정을 이용한 플라스틱 기판에 메탈 라인 형성
- Author
- 박진구
- Keywords
- CMP; chemical mechanical planarization; hot embossing; plastic substrate; metal line
- Issue Date
- 2005-06
- Publisher
- 한국전기전자재료학회
- Citation
- 2005 한국전기전자재료학회 하계학술대회 논문집, Page. 655-656
- Abstract
- In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.
- URI
- http://kiss.kstudy.com/thesis/thesis-view.asp?key=3341244https://repository.hanyang.ac.kr/handle/20.500.11754/111244
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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