2004-02 | A 3D Numerical Study of the Polishing Behavior during an Oxide Chemical Mechanical Planarization Process | 박진구 |
2016-12 | A novel cleaning approach to remove the carbon contaminant from Ru surface of EUV mask | 박진구 |
2011-05 | A Self-Assembled Monolayer-Based Micropatterned Array for Controlling Cell Adhesion and Protein Adsorption | 박진구 |
2014-02 | Abrasive and additive interactions in high selectivity STI CMP slurries | 박진구 |
2023-05-19 | Acoustic power dependent detachment of PSL particles adhered to glass surfaces by dissolved gas and anionic surfactant in an ultrasonic field | 박진구 |
2017-12 | Adhesion and removal behavior of particulate contaminants from EUV mask materials | 박진구 |
2003-02 | Adhesion and removal of silica and alumina slurry particles during Cu CMP process | 박진구 |
2008-12 | Adhesion and Removal of Silica and Ceria Particles on the Wafer Surfaces in STI and Poly Si CMP | 박진구 |
2009-02 | Adhesion force change on multilayer EUVL mask due to laser induced plasma shock wave | 박진구 |
2020-12 | Adhesive resin composites with ceramic nanoparticles for enhanced light extraction efficiency of sandwiched LED device structure | 박진구 |
2017-08 | Adsorption of sodium dodecyl sulfate on cleaning of an N-polar GaN surface in an alkaline solution | 박진구 |
2009-12 | Analysis of Scratches Formed on Oxide Surface during Chemical Mechanical Planarization | 박진구 |
2018-05 | Area-selective atomic layer deposition using inkjet-printed fluorocarbon patterns as mask layers | 박진구 |
2023-04-14 | Benzethonium chloride as a tungsten corrosion inhibitor in neutral and alkaline media for the post-chemical mechanical planarization application | 박진구 |
2019-06 | A Breakthrough Method for the Effective Conditioning of PVA Brush Used for Post-CMP Process | 박진구 |
2006-12 | Characteristics of high power laser shock waves and their cleaning performance | 박진구 |
2016-12 | Characterization of ammonium silicate residue during Polysilazane (PSZ) dry etching in NF3/H2O gas chemistry | 박진구 |
2014-12 | Characterization of Cu-BTA organic complexes on Cu during Cu CMP and post Cu cleaning | 박진구 |
2020-07 | Characterization of Different Cobalt Surfaces and Interactions with Benzotriazole for CMP Application | 박진구 |
2018-04 | Characterization of Free-Standing Nano-Membranes by Using Ellipsometry | 박진구 |
2014-06 | Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution | 박진구 |
2007-06 | Characterization of SUS Molds for light guide-plates by electro-chemical fabrication (ECF) method | 박진구 |
2013-02 | Characterization of TMAH based cleaning solution for post Cu-CMP application | 박진구 |
2004-02 | Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance | 박진구 |
2007-04 | Chemical and nanomechanical characteristics of fluorocarbon thin films deposited by using plasma enhanced chemical vapor deposition | 박진구 |
2000-11 | Chemical, optical and tribological characterization of perfluoropolymer films as an anti-stiction layer in micro-mirror arrays | 박진구 |
2021-12 | Chemically controlled megasonic cleaning of patterned structures using solutions with dissolved gas and surfactant | 박진구 |
2011-08 | Citric Acid and NaIO4 Based Alkaline Cleaning Solution for Particle Removal during Post-Ru CMP Cleaning | 박진구 |
2011-12 | CMP defects | 박진구 |
2004-07 | CMP 공정중 전기화학적 방법과 마찰력을 이용하여 Cu Wafer와 Disc의 특성 비교 | 박진구 |