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dc.contributor.author정재경-
dc.date.accessioned2018-03-23T08:44:33Z-
dc.date.available2018-03-23T08:44:33Z-
dc.date.issued2014-12-
dc.identifier.citationSOLID-STATE ELECTRONICS, 권: 104, 페이지: 86-89en_US
dc.identifier.issn0038-1101-
dc.identifier.issn1879-2405-
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S0038110114002834?via%3Dihub-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/51645-
dc.description.abstractThe trap distribution of a polysilicon (poly-Si) channel in a metal-oxide-semiconductor field effect transistor (MOSFET) was extracted successfully using a variable amplitude charge pumping method (VACP) and an energy band bending model. Compared to single crystal Si channels, the poly-Si channels exhibited a high density of bulk channel traps due to the presence of grain boundaries. The densities of the trap states existing in the poly-silicon channel with various grain sizes and channel thicknesses were extracted and compared. The grain size of poly-Si was found to have a stronger impact on the trap distribution than the channel thickness. After hot carrier stress, the trap density in the poly-silicon channel increases and the generated traps are located both at mid gap energy level and near the conduction band energy level. (C) 2014 Elsevier Ltd. All rights reserved.en_US
dc.description.sponsorshipThis research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning (2012R1A 2A2A02005854). This work was also supported by an Inha University Research Grant.en_US
dc.language.isoenen_US
dc.publisherPERGAMON-ELSEVIER SCIENCE LTDen_US
dc.subjectPolysiliconen_US
dc.subjectCharge pumpingen_US
dc.subjectChannel trap densityen_US
dc.subjectTrap distributionen_US
dc.subjectGrain size effecten_US
dc.subjectHot carrier injectionen_US
dc.titleAnalysis of trap distribution in polysilicon channel transistors using the variable amplitude charge pumping methoden_US
dc.typeArticleen_US
dc.relation.volume104-
dc.identifier.doi10.1016/j.sse.2014.11.015-
dc.relation.page86-89-
dc.relation.journalSOLID-STATE ELECTRONICS-
dc.contributor.googleauthorManh-Cuong Nguyen-
dc.contributor.googleauthorJeon, Yoon-Seok-
dc.contributor.googleauthorTong, Duc-Tai-
dc.contributor.googleauthorYou, Seung-Won-
dc.contributor.googleauthorJeong, Jae-Kyeong-
dc.contributor.googleauthorKim, Bio-
dc.contributor.googleauthorAhn, Jae-Young-
dc.contributor.googleauthorHwang, Kihyun-
dc.contributor.googleauthorChoi, Rino-
dc.relation.code2014039627-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDEPARTMENT OF ELECTRONIC ENGINEERING-
dc.identifier.pidjkjeong1-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > ELECTRONIC ENGINEERING(융합전자공학부) > Articles
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