Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2018-03-20T07:32:53Z | - |
dc.date.available | 2018-03-20T07:32:53Z | - |
dc.date.issued | 2012-04 | - |
dc.identifier.citation | Journal of Alloys and Compounds, Sep 2012, 535, P.33-38 | en_US |
dc.identifier.issn | 0925-8388 | - |
dc.identifier.uri | https://www.sciencedirect.com/science/article/pii/S0925838812007268?via%3Dihub | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/49752 | - |
dc.description.abstract | We developed a new sputtered under bump metallurgy (UBM) based on Ni-20wt% Zn thin films for Pb-free solders. This study focuses on the interfacial reactions between two Pb-free solders (Sn3.0Ag0.5Cu and Sn1.0Ag0.7Cu) and a Ni-Zn alloy UBM. By adding Zn to Ni UBM, Zn is incorporated into intermetallic compounds (IMCs) to form a quaternary Cu-Ni-Zn-Sn phase at the solder/Ni-Zn interface after reflow and subsequent isothermal aging. The Ni-Zn UBM sufficiently reduces the interfacial reaction and IMCs formation rates as well as UBM consumption rates compared to a Ni UBM. In particular, the formation of (Ni, Cu)(3)Sn-4 IMC was significantly retarded by adding Zn into UBM. (C) 2012 Elsevier B.V. All rights reserved. | en_US |
dc.description.sponsorship | This work was supported by the National Research Foundation of Korea (NRF) Grant funded by the Korea government (MEST) (No.2011-0015735). | en_US |
dc.language.iso | en | en_US |
dc.publisher | Elsevier Science B.V., Amsterdam. | en_US |
dc.subject | Pb-free solders | en_US |
dc.subject | Ni-Zn | en_US |
dc.subject | Under bump metallization | en_US |
dc.subject | Interfacial reactions | en_US |
dc.subject | Microstructure | en_US |
dc.title | Sputtered Ni-Zn under bump metallurgy (UBM) for Sn-Ag-Cu solders | en_US |
dc.type | Article | en_US |
dc.relation.volume | 535 | - |
dc.identifier.doi | 10.1016/j.jallcom.2012.04.062 | - |
dc.relation.page | 33-38 | - |
dc.relation.journal | JOURNAL OF ALLOYS AND COMPOUNDS | - |
dc.contributor.googleauthor | Kim, Tae Jin | - |
dc.contributor.googleauthor | Kim, Young Min | - |
dc.contributor.googleauthor | Kim, Young-Ho | - |
dc.relation.code | 2012204617 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | kimyh | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.