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dc.contributor.author박진성-
dc.date.accessioned2018-03-17T05:00:34Z-
dc.date.available2018-03-17T05:00:34Z-
dc.date.issued2014-09-
dc.identifier.citationACS APPLIED MATERIALS & INTERFACES, 2014, 6(20), p.7481-17488en_US
dc.identifier.issn1944-8244-
dc.identifier.urihttps://pubs.acs.org/doi/10.1021/am502085c-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/48301-
dc.description.abstractHighly conductive indium oxide films, electrically more conductive than commercial sputtered indium tin oxide films films, were deposited using a new liquid precursor Et2InN(SiMe3)(2) and H2O by atomic layer deposition (ALD) at 225-250 degrees C. Film resistivity can be as low as 2.3 x 10(-4)-5.16 x 10(-5) Omega.cm (when deposited at 225-250 degrees C). Optical transparency of >80% at wavelengths of 400-700 nm was obtained for all the deposited films. A self-limiting ALD growth mode was found 0.7 angstrom/cycle at 175-250 degrees C. X-ray photoelectron spectroscopy depth profile analysis showed pure indium oxide thin film without carbon or any other impurity. The physical and chemical properties were systematically analyzed by transmission electron microscopy, electron energy loss spectroscopy, X-ray diffraction, optical spectrometer, and hall measurement; it was found that the enhanced electrical conductivity is attributed to the oxygen deficient InOx phases.en_US
dc.description.sponsorshipThis research was supported by UP Chemical and Korea Sanhak Foundation in 2012 and partially supported by the Global Frontier R&D Program through the Global Frontier Hybrid Interface Materials (GFHIM) of the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning (2013M3A6B1078870 and 2013M3A6B1078872).en_US
dc.language.isoenen_US
dc.publisherAMER CHEMICAL SOC, 1155 16TH ST, NW, WASHINGTON, DC 20036 USAen_US
dc.subjectindium oxideen_US
dc.subjectatomic layer depositionen_US
dc.subjecttransparent conducting oxideen_US
dc.subjectresistivityen_US
dc.titleHighly Conducting, Transparent, and Flexible Indium Oxide Thin Film Prepared by Atomic Layer Deposition Using a New Liquid Precursor Et2InN(SiMe3)(2)en_US
dc.typeArticleen_US
dc.relation.volume6-
dc.identifier.doi10.1021/am502085c-
dc.relation.page17481-17488-
dc.relation.journalACS APPLIED MATERIALS & INTERFACES-
dc.contributor.googleauthorMaeng, Wan Joo-
dc.contributor.googleauthorChoi, Dong-won-
dc.contributor.googleauthorChung, Kwun-Bum-
dc.contributor.googleauthorKoh, Wonyong-
dc.contributor.googleauthorKim, Gi-Yeop-
dc.contributor.googleauthorChoi, Si-Young-
dc.contributor.googleauthorPark, Jin-Seong-
dc.relation.code2014023980-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MATERIALS SCIENCE AND ENGINEERING-
dc.identifier.pidjsparklime-
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COLLEGE OF ENGINEERING[S](공과대학) > MATERIALS SCIENCE AND ENGINEERING(신소재공학부) > Articles
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