Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박종완 | - |
dc.date.accessioned | 2018-03-13T07:37:01Z | - |
dc.date.available | 2018-03-13T07:37:01Z | - |
dc.date.issued | 2013-11 | - |
dc.identifier.citation | THIN SOLID FILMS, 권: 547, 페이지: 141-145 | en_US |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://kiss.kstudy.com/thesis/thesis-view.asp?key=3388080 | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/46173 | - |
dc.description.abstract | We investigated the influence of annealing on the diffusion barrier property in a Mn-based and V-based barrier layer. The samples were annealed at various temperatures for 1 h in vacuum. X-ray diffraction revealed Cu (111), Cu (200) and Cu (220) peaks for the Cu-Mn and Cu-V alloys. Transmission electron microscopy showed that a 4-7 nm V-based interlayer self-formed and a 2-5 nm Mn-based interlayer self-formed at the interface after annealing. The resistivity of the annealed Cu-V alloy was reduced to 8.1 mu Omega-cm, which is greater than the resistivity of the annealed Cu-Mn alloy. The Mn-based interlayer and V-based interlayer showed excellent thermal stability. The results show that Mn and V based Cu alloys are suitable seed layer materials for Cu interconnects. (C) 2013 Elsevier B. V. All rights reserved. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCIENCE SA, PO BOX 564, 1001 LAUSANNE, SWITZERLAND | en_US |
dc.subject | Cu interconnection | en_US |
dc.subject | Self-forming barrier | en_US |
dc.subject | V | en_US |
dc.subject | Mn | en_US |
dc.title | Self-forming barrier characteristics of Cu-V and Cu-Mn films for Cu interconnects | en_US |
dc.type | Article | en_US |
dc.relation.volume | 547 | - |
dc.identifier.doi | 10.1016/j.tsf.2013.04.052 | - |
dc.relation.page | 141-145 | - |
dc.relation.journal | THIN SOLID FILMS | - |
dc.contributor.googleauthor | Park, Jae-Hyung | - |
dc.contributor.googleauthor | Moon, Dae-Yong | - |
dc.contributor.googleauthor | Han, Dong-Suk | - |
dc.contributor.googleauthor | Kang, Yu-Jin | - |
dc.contributor.googleauthor | Shin, So-Ra | - |
dc.contributor.googleauthor | Park, Jong-Wan | - |
dc.relation.code | 2013012183 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | jwpark | - |
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