Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 박종완 | - |
dc.date.accessioned | 2018-02-22T04:33:29Z | - |
dc.date.available | 2018-02-22T04:33:29Z | - |
dc.date.issued | 2012-10 | - |
dc.identifier.citation | Thin Solid Films, Vol.521, No.- [2012], p146-149 | en_US |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | https://www.sciencedirect.com/science/article/pii/S0040609012001320?via%3Dihub | - |
dc.identifier.uri | http://hdl.handle.net/20.500.11754/39519 | - |
dc.description.abstract | Conformal Cu-Mn seed layers were deposited by plasma enhanced atomic layer deposition (PEALD) at low temperature (120 degrees C), and the Mn content in the Cu-Mn alloys were controlled form 0 to approximately 10 atomic percent with various Mn precursor feeding times. Resistivity of the Cu-Mn alloy films decreased by annealing due to out-diffusion of Mn atoms. Out-diffused Mn atoms were segregated to the surface of the film and interface between a Cu-Mn alloy and SiO2, resulting in self-formed MnOx and MnSixOy, respectively. The adhesion between Cu and SiO2 was enhanced by the formation of MnSixOy. Continuous and conductive Cu-Mn seed layers were deposited with PEALD into 24 nm SiO2 trench, enabling a low temperature process, and the trench was perfectly filled using electrochemical plating under conventional conditions. (C) 2012 Elsevier B.V. All rights reserved. | en_US |
dc.language.iso | en | en_US |
dc.publisher | ELSEVIER SCIENCE SA, PO BOX 564, 1001 LAUSANNE, SWITZERLAND | en_US |
dc.subject | Cu seed layer | en_US |
dc.subject | Atomic layer deposition | en_US |
dc.subject | Self-forming barrier | en_US |
dc.subject | Cu interconnect | en_US |
dc.subject | Manganese silicate | en_US |
dc.title | Plasma-enhanced atomic layer deposition of Cu-Mn films with formation of a MnSixOy barrier layer | en_US |
dc.type | Article | en_US |
dc.relation.volume | 521 | - |
dc.identifier.doi | 10.1016/j.tsf.2012.02.015 | - |
dc.relation.page | 146-149 | - |
dc.relation.journal | THIN SOLID FILMS | - |
dc.contributor.googleauthor | Moon, Dae-Yong | - |
dc.contributor.googleauthor | Han, Dong-Suk | - |
dc.contributor.googleauthor | Park, Jae-Hyung | - |
dc.contributor.googleauthor | Shin, Sae-Young | - |
dc.contributor.googleauthor | Park, Jong-Wan | - |
dc.contributor.googleauthor | Kim, Baek Mann | - |
dc.contributor.googleauthor | Cho, Jun Yeol | - |
dc.relation.code | 2012209470 | - |
dc.sector.campus | S | - |
dc.sector.daehak | COLLEGE OF ENGINEERING[S] | - |
dc.sector.department | DIVISION OF MATERIALS SCIENCE AND ENGINEERING | - |
dc.identifier.pid | jwpark | - |
dc.identifier.researcherID | 57049730400 | - |
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