Repository at Hanyang UniversityCOLLEGE OF ENGINEERING[S](공과대학)MECHANICAL ENGINEERING(기계공학부)Articles
430 0

Full metadata record

DC FieldValueLanguage
dc.contributor.author김학성-
dc.date.accessioned2016-11-11T04:44:58Z-
dc.date.available2016-11-11T04:44:58Z-
dc.date.issued2015-04-
dc.identifier.citation재료 및 파괴부문 춘계학술대회 논문집 , 2015.4, 265-266en_US
dc.identifier.urihttp://www.dbpia.co.kr/Article/NODE06269276-
dc.identifier.urihttp://hdl.handle.net/20.500.11754/24304-
dc.description.sponsorship본 논문은 정부(교육부)의 재원으로 한국연구재단의 지원을 받아 수행된 연구임.(No.2012R1A6A1029029 and 2013M2A2A9043280).en_US
dc.language.isoko_KRen_US
dc.publisher대한기계학회en_US
dc.title테라헤르츠파 비파괴검사법을 이용한 반도체 패키징 내부 공동 검출에 관한 연구en_US
dc.title.alternativeThe detection of the voids in semiconductor packages using non-destructive evaluation of THz-TDSen_US
dc.typeArticleen_US
dc.relation.page1-2-
dc.contributor.googleauthor박성현-
dc.contributor.googleauthor장진욱-
dc.contributor.googleauthor김학성-
dc.contributor.googleauthorPark, Sung Hyeon-
dc.contributor.googleauthorJang, Jin Wook-
dc.contributor.googleauthorKim, Hak Sung-
dc.sector.campusS-
dc.sector.daehakCOLLEGE OF ENGINEERING[S]-
dc.sector.departmentDIVISION OF MECHANICAL ENGINEERING-
dc.identifier.pidkima-
Appears in Collections:
COLLEGE OF ENGINEERING[S](공과대학) > MECHANICAL ENGINEERING(기계공학부) > Articles
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML
Show simple item record


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE