Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles
- Title
- Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles
- Author
- 이선영
- Keywords
- CVD process; Defective multi-layer graphene; High thermal conductivity; Metal TIMs filler; PVP solution; Silver nanoparticle
- Issue Date
- 2023-09
- Publisher
- Elsevier B.V.
- Citation
- Microelectronic Engineering, v. 281, article no. 112082, Page. 1.0-8.0
- Abstract
- To increase the thermal conductivity of thermal interface materials (TIM), the selection of thermally conductive filler is crucial. In this study, defective graphene-coated silver nanoparticles (Ag NPs) were selected as TIM fillers with low electrical resistivity. Poly-vinylpyrrolidone (PVP) coated Ag NPs were fabricated by polyol process to be used as a precursor, while a multi-layer graphene (MLG) coated layer about 3–4 nm in thickness was formed on the surface of Ag NPs which is 95 nm through a chemical vapor deposition (CVD) process. For application as a metal TIM filler for MLG-coated Ag NPs, the thermal properties of MLG-coated Ag NPs with varying ratios of PVP solution added to the PVP-coated Ag NPs during CVD, were evaluated. Moreover, the peak for crystalline carbon was confirmed through XRD analysis at 26.207°, while the d-spacing was measured to be 3.40 Å. Through Raman analysis, the presence of D peak (1350 cm−1), G peak (1590 cm−1), and 2D peak (2850 cm−1) proved the successful formation of defective MLG on the surface of Ag NPs. Finally, high thermal conductivity of 71 W/(m∙K) with electrical resistivity of 6.0 × 10−8 Ω∙m was obtained when adding 60 wt% PVP solution to PVP-coated Ag NPs during CVD, showing complete isolation among MLG-coated Ag NPs while PVP solution added less than 60 wt% did not prevent Ag NPs from coarsening, increasing its electrical resistivity. Therefore, nano-capsuled TIM fillers composed of defective MLG-coated Ag NPs with high thermal conductivities were obtained to demonstrate their potential for high-performance computing devices in thermal management. © 2023
- URI
- https://www.sciencedirect.com/science/article/pii/S0167931723001478?pes=vorhttps://repository.hanyang.ac.kr/handle/20.500.11754/187753
- ISSN
- 0167-9317;1873-5568
- DOI
- 10.1016/j.mee.2023.112082
- Appears in Collections:
- COLLEGE OF ENGINEERING SCIENCES[E](공학대학) > MATERIALS SCIENCE AND CHEMICAL ENGINEERING(재료화학공학과) > Articles
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